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SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today the launch of its DDR4 Mini-DIMM, one of the industry's first Mini-DIMM form factor utilizing next generation DDR4 technology.
SMART's initial lineup of DDR4-2133 Mini-DIMMs includes 8GB and 16GB VLP Mini-UDIMM along with 8GB and 16GB standard height Mini-RDIMMs, all of which comply with JEDEC 288-pin form factor and pin-out standards. Today, Mini-DIMMs are widely used across many application segments including networking, telecom, industrial, computing and storage by OEMs who are looking to save board space or source as an alternative to SO-DIMMs. The attractiveness of Mini-DIMMs is that they are versatile; it's a small form factor offered in high densities operating at high data transfer rates. For OEMs currently using DDR3 Mini-DIMMs, SMART is pleased to offer a migration path to DDR4.
To further promote a smooth transition to DDR4 Mini-DIMMs, SMART is collaborating with Molex, a global provider of complete interconnect solutions, who has developed a robust DDR4 Mini-DIMM vertical-mount 288-pin socket with secure latches. Designed with additional power and ground signals compared to SO-DIMMs, Mini-DIMMs can be used with Molex' secure latching sockets -- ideal for long life-cycle OEM products requiring high durability, high density, and high performance. "We are pleased to help drive industry adoption and JEDEC standardization of the DDR4 Mini-DIMM socket," stated WK Poon, Product Manager at Molex. "Our goal in close collaboration with SMART is to help support customers in the migration to DDR4 Mini-DIMMs."
SMART and Molex can provide full engineering support for OEMs wishing to design in DDR4 Mini-DIMMs. This support includes thermal, mechanical and IBIS models along with engineering consultations and samples. SMART is collaborating with various processor suppliers as well to insure the full compatibility of its DDR4 Mini-DIMMs with industry-leading processors.
View at TechPowerUp Main Site
SMART's initial lineup of DDR4-2133 Mini-DIMMs includes 8GB and 16GB VLP Mini-UDIMM along with 8GB and 16GB standard height Mini-RDIMMs, all of which comply with JEDEC 288-pin form factor and pin-out standards. Today, Mini-DIMMs are widely used across many application segments including networking, telecom, industrial, computing and storage by OEMs who are looking to save board space or source as an alternative to SO-DIMMs. The attractiveness of Mini-DIMMs is that they are versatile; it's a small form factor offered in high densities operating at high data transfer rates. For OEMs currently using DDR3 Mini-DIMMs, SMART is pleased to offer a migration path to DDR4.
To further promote a smooth transition to DDR4 Mini-DIMMs, SMART is collaborating with Molex, a global provider of complete interconnect solutions, who has developed a robust DDR4 Mini-DIMM vertical-mount 288-pin socket with secure latches. Designed with additional power and ground signals compared to SO-DIMMs, Mini-DIMMs can be used with Molex' secure latching sockets -- ideal for long life-cycle OEM products requiring high durability, high density, and high performance. "We are pleased to help drive industry adoption and JEDEC standardization of the DDR4 Mini-DIMM socket," stated WK Poon, Product Manager at Molex. "Our goal in close collaboration with SMART is to help support customers in the migration to DDR4 Mini-DIMMs."
SMART and Molex can provide full engineering support for OEMs wishing to design in DDR4 Mini-DIMMs. This support includes thermal, mechanical and IBIS models along with engineering consultations and samples. SMART is collaborating with various processor suppliers as well to insure the full compatibility of its DDR4 Mini-DIMMs with industry-leading processors.
View at TechPowerUp Main Site
