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KLEVV High Performance Gaming Memory Modules Now Available in Europe

btarunr

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Essencore Limited, a noteworthy newcomer in DRAM modules and NAND Flash application products including Gaming Memory Modules, Solid State Drives, USB Flash Drives and MicroSD cards, is pleased to announce the sales kick-off in European countries with its brand "KLEVV". In attempt to expand its global presence and to accelerate growth, Essencore hopes that this KLEVV product launch will help to efficiently deliver its premium products to its European customer.

As a young company founded in 2014 by CEO IU Kim, Essencore strives to become world's leading vendor of both DRAM modules and NAND Flash application products. To achieve this goal, Essencore has introduced its house brand "KLEVV" with the industry's first-rate quality and best performing products. In a conscious move to strengthen brand awareness and products at this early stage, KLEVV will focus on the three key consumer markets of U.S., Europe and China. Of all regions, Europe is deemed to have the highest potential, with its huge population of tech enthusiasts. Starting in Germany, UK, and Poland in summer 2015, KLEVV products will soon be available in all corners of Europe.



SS Roh, Vice President of Essencore and Director of KLEVV division comments: "It's a great opportunity for us. We are extremely proud to be taking this step, which will no doubt be considered as a stepping stone for KLEVV success in Europe for years to come. Our intention for this year is to focus on the major markets in Europe and start developing channel and growing the number of distributors, retailers and e-tailers so that consumers can enjoy KLEVV products."

IU Kim, President of Essencore comments: "Despite the fact that more than half of the memory chips in the world are manufactured by Korean companies, there's been no Korean module maker that produces consumer-centric memory application products. By combining the technical know-how in memory, funding power of SK Group and family-like relation with SK Hynix, Essencore will no doubt become the world's leading consumer company in a very short period of time" He concludes.

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I sure hope there is better memory than this when we are forced to upgrade to DDR4 on the other future platforms.

Right now I'm rocking DDR3-2400CL9. I just don't see how this DDR4 shit can be useful for gaming with CL15-16...

Hell, if my Athlon had a quad channel memory controller, my AIDA scores would be better than a lot of the Haswell Es.
 
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WHEN will the White LED versions be available in north america? I've mailed the company 6times, no answer to this simple question. The website is full of 9-mile long superlatives explaining how tremendously advanced you will feel once you purchase a few sticks, yet no description of LED selection color control or availability, at Newegg only the red LED are for sale yet no description of which color you are purchasing, you must ask previous buyers which one they ended up with. So much confusion on this subject our own TPU thinks the LEDs are RGB, oh geez, it's not their fault the company avoids the question at every opportunity, not a good beginning for this group.

Whomever designed the four styles of memory modules I applaud them, thank you for finally giving us a beautiful alternative to the brand of which we do not speak. Now please guys add some descriptions with your products, make the white LED and 3200MHz sku available to all.

Peace and Love
 
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I sure hope there is better memory than this when we are forced to upgrade to DDR4 on the other future platforms.

Right now I'm rocking DDR3-2400CL9. I just don't see how this DDR4 shit can be useful for gaming with CL15-16...

Hell, if my Athlon had a quad channel memory controller, my AIDA scores would be better than a lot of the Haswell Es.

And in practice it's all basically irrelevant (around 3% difference between DDDR3-2666 and DDR3-1600) thanks to the huge size of modern caches, prefetching and magical prediction techniques.

CL also doesn't tell the whole story, especially when you're working with multiple very large modules with multiple ranks and on-DIMM buffers - on Haswell-E, from 2 DIMMs per channel and up, LRDIMMs (traditionally highest latency because of it's LR buffer) have pretty much equal latency (+- 0.5ns)
 
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And in practice it's all basically irrelevant (around 3% difference between DDDR3-2666 and DDR3-1600) thanks to the huge size of modern caches, prefetching and magical prediction techniques.

CL also doesn't tell the whole story, especially when you're working with multiple very large modules with multiple ranks and on-DIMM buffers - on Haswell-E, from 2 DIMMs per channel and up, LRDIMMs (traditionally highest latency because of it's LR buffer) have pretty much equal latency (+- 0.5ns)

I'm not planning on using Haswell E, ever. My CPU doesn't even have L3 cache...
 
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I'm not planning on using Haswell E, ever. My CPU doesn't even have L3 cache...

Same arguments also apply to all other processors, it's just much easier to demonstrate using high-end chips that support the higher-end tech in the first place.

L3 vs L2 cache doesn't mean much, how much of it you have is the important part, and in that respect, 4MB of cache is sufficient to hide latency differences for most use cases.
 
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