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But they aren't the only metrics in play are they? If they were, Intel would be turning over process nodes as fast as was technically possible and would have pushed to 450mm wafers ages ago. At least Samsung and TSMC and co. can gouge the hell out of their customers to offset the price of building/upgrading their fabs, clean room costs - litho tooling, test and validation tooling etc. Intel largely produces for its own product lines.I like that part but unfortunately, for the last couple of generations, the CPU portion of the die in Intel's CPUs has been getting smaller and smaller while the price per CPU has remained roughly the same (or has even increased) . And we'll keep getting screwed harder and harder without any competition for Intel.
You also need to factor in the die space allocated for IGP (and eDRAM where applicable) for mainstream processors. And as you should be aware, die size for -E/-EP/-EN/-EX hasn't fallen for the most part.
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