Raevenlord
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| System Name | The Ryzening |
|---|---|
| Processor | AMD Ryzen 9 5900X |
| Motherboard | MSI X570 MAG TOMAHAWK |
| Cooling | Lian Li Galahad 360mm AIO |
| Memory | 32 GB G.Skill Trident Z F4-3733 (4x 8 GB) |
| Video Card(s) | Gigabyte RTX 3070 Ti |
| Storage | Boot: Transcend MTE220S 2TB, Kintson A2000 1TB, Seagate Firewolf Pro 14 TB |
| Display(s) | Acer Nitro VG270UP (1440p 144 Hz IPS) |
| Case | Lian Li O11DX Dynamic White |
| Audio Device(s) | iFi Audio Zen DAC |
| Power Supply | Seasonic Focus+ 750 W |
| Mouse | Cooler Master Masterkeys Lite L |
| Keyboard | Cooler Master Masterkeys Lite L |
| Software | Windows 10 x64 |
AMD's RX Vega supply has seen exceedingly limited quantities available since launch. This has been due to a number of reasons, though the two foremost that have been reported are: increased demand from cryptocurrency miners, who are looking towards maximizing their single node hashrate density through Vega's promising mining capabilities; and yield issues with AMD's Vega 10 HBM2 packaging partner, Advanced Semiconductor Engineering (ASE). It's expected that chip yield for Vega 10 is also lower per se, due to it having a 484 mm² die, which is more prone to defects than a smaller one, thus reducing the amount of fully-enabled GPUs.
AMD's production partner, GlobalFoundries, has historically been at the center of considerations on AMD's yield problems. That GlobalFoundries is seemingly doing a good job with Ryzen may not be much to say: those chips have incredibly small die sizes (192 mm²) for their number of cores. It seems that Global Foundries only hits problems with increased die sizes and complexity (which is, unfortunately for AMD, where it matters most).
Due to these factors, it seems that AMD is looking to change manufacturers for both their chip yield issues, and packaging yield problems. ASE, which has seen a 10% revenue increase for the month of August (not coincidentally, the month that has seen AMD's RX Vega release) is reportedly being put in charge of a much smaller number of packaging orders, with Siliconware Precision Industries (SPIL), who has already taken on some Vega 10 packaging orders of its own, being the one to receive the bulk of Vega 11 orders. Vega 11 is expected to be the mainstream version of the Vega architecture, replacing Polaris' RX 500 series. Reports peg Vega 11 as also including HBM2 memory in their design instead of GDDR5 memory. Considering AMD's HBM memory history with both the original Fury and and now RX Vega, as well as the much increased cost of HBM2's implementation versus a more conventional GDDR memory subsystem, this editor reserves itself the right to be extremely skeptical that this is true. If it's indeed true, and Vega 11 indeed does introduce HBM2 memory to the mainstream GPU market, then... We'll talk when (if) we get there.
As to its die yield issues, AMD is reported to be changing their main supplier for their 7 nm AI-geared Vega 20 from GlobalFoundries to Taiwan Semiconductor Manufacturing Company (TSMC), who has already secured orders for AI chips from NVIDIA and Google. TSMC's 7nm and CoWoS (chip-on-wafer-on-substrate) capabilities have apparently proven themselves enough for AMD to change manufacturers. How this will affect AMD and GlobalFoundries' Wafer Agreement remains to be seen, but we expect AMD will be letting go of some additional payments GlobalFoundries' way.
View at TechPowerUp Main Site
AMD's production partner, GlobalFoundries, has historically been at the center of considerations on AMD's yield problems. That GlobalFoundries is seemingly doing a good job with Ryzen may not be much to say: those chips have incredibly small die sizes (192 mm²) for their number of cores. It seems that Global Foundries only hits problems with increased die sizes and complexity (which is, unfortunately for AMD, where it matters most).
Due to these factors, it seems that AMD is looking to change manufacturers for both their chip yield issues, and packaging yield problems. ASE, which has seen a 10% revenue increase for the month of August (not coincidentally, the month that has seen AMD's RX Vega release) is reportedly being put in charge of a much smaller number of packaging orders, with Siliconware Precision Industries (SPIL), who has already taken on some Vega 10 packaging orders of its own, being the one to receive the bulk of Vega 11 orders. Vega 11 is expected to be the mainstream version of the Vega architecture, replacing Polaris' RX 500 series. Reports peg Vega 11 as also including HBM2 memory in their design instead of GDDR5 memory. Considering AMD's HBM memory history with both the original Fury and and now RX Vega, as well as the much increased cost of HBM2's implementation versus a more conventional GDDR memory subsystem, this editor reserves itself the right to be extremely skeptical that this is true. If it's indeed true, and Vega 11 indeed does introduce HBM2 memory to the mainstream GPU market, then... We'll talk when (if) we get there.
As to its die yield issues, AMD is reported to be changing their main supplier for their 7 nm AI-geared Vega 20 from GlobalFoundries to Taiwan Semiconductor Manufacturing Company (TSMC), who has already secured orders for AI chips from NVIDIA and Google. TSMC's 7nm and CoWoS (chip-on-wafer-on-substrate) capabilities have apparently proven themselves enough for AMD to change manufacturers. How this will affect AMD and GlobalFoundries' Wafer Agreement remains to be seen, but we expect AMD will be letting go of some additional payments GlobalFoundries' way.
View at TechPowerUp Main Site
