I found this video on youtube to give me an idea what I am dealing with for the first time (Indium)
This should be easy for me to solder & desolder CPUs as I have already done BGA CPU soldering/reballing, so I should get the job done first time with no errors.
Anyone that does BGA soldering/desoldering should be able to do this without errors first time & every time without errors, & I know there are a few of you out there.
Hotplate does seem to be the perfect tool for this, but I will be using a workstation. So all those CPUs/APUs out there that are not soldered, can be soldered. I have two methods how to solder CPUs, I will test both, then practice removing IHS, then I will move to coldplate/CPU soldering.
Still awaiting Indium to arrive.
EDIT: The reason I say this should be easy for users that do BGA soldering is because, you are already dealing with temperatures around 175c-220c when you are soldering-in BGA CPUs or BGA components. So I expect perfection "first time".
I should also make you aware the soldered route also has a higher conductivity of heat, better than Liquid Metal Compound. This has already shown-up when I did the IHS to Heatsink direct soldering & I expect further improvements when die is also soldered.