- Joined
- May 22, 2015
- Messages
- 13,846 (3.95/day)
Processor | Intel i5-12600k |
---|---|
Motherboard | Asus H670 TUF |
Cooling | Arctic Freezer 34 |
Memory | 2x16GB DDR4 3600 G.Skill Ripjaws V |
Video Card(s) | EVGA GTX 1060 SC |
Storage | 500GB Samsung 970 EVO, 500GB Samsung 850 EVO, 1TB Crucial MX300 and 2TB Crucial MX500 |
Display(s) | Dell U3219Q + HP ZR24w |
Case | Raijintek Thetis |
Audio Device(s) | Audioquest Dragonfly Red :D |
Power Supply | Seasonic 620W M12 |
Mouse | Logitech G502 Proteus Core |
Keyboard | G.Skill KM780R |
Software | Arch Linux + Win10 |
How do you know ? They use a different process. TSMC is miles ahead of everyone.
It's not the process. Larger dies have been problematic to build for ages. If you understood a bit how chips are made, we wouldn't be having this conversation.