Raevenlord
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Even as researchers expect 3D NAND flash to achieve the 140-layer level by 2021, technology and manufacturers still have to take all the intermediate steps before we're actually there. In that sense, Western Digital has just announced that they're well on their way in producing 96-layer 3D NAND and distributing it to customers. For now, the memory will be used for inexpensive storage solutions, but the idea is to eventually ramp um production for other, higher-performance products.
Western Digital CEO Steve Milligan kept the production ramp-up (and the expectation of BiCS4 production eventually surpassing BiCS3) under wraps, but it seems all is going well with the production. He added that "(...) if you look to where we at from a yield curve perspective, because [BICS4] is not too mature, we are very pleased with where we are. Because once you get to a certain point, you can project where you are going to end at (based on cycles of learning, etc)." As announced by Western Digital before, it's likely this initial production run is delivering 256 Gb capacity chips, with improvements in yields to allow for increased capacity down the road, eventually, up to 1 Tb capacity per chip.
View at TechPowerUp Main Site
Western Digital CEO Steve Milligan kept the production ramp-up (and the expectation of BiCS4 production eventually surpassing BiCS3) under wraps, but it seems all is going well with the production. He added that "(...) if you look to where we at from a yield curve perspective, because [BICS4] is not too mature, we are very pleased with where we are. Because once you get to a certain point, you can project where you are going to end at (based on cycles of learning, etc)." As announced by Western Digital before, it's likely this initial production run is delivering 256 Gb capacity chips, with improvements in yields to allow for increased capacity down the road, eventually, up to 1 Tb capacity per chip.
View at TechPowerUp Main Site
