JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard

[btarunr]

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution's success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235B is available for download from the JEDEC website.

JEDEC standard JESD235B for HBM leverages Wide I/O and TSV technologies to support densities up to 24 GB per device at speeds up to 307 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard can support 2-high, 4-high, 8-high, and 12-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB - 24 GB per stack.

This update extends the per pin bandwidth to 2.4 Gbps, adds a new footprint option to accommodate the 16 Gb-layer and 12-high configurations for higher density components, and updates the MISR polynomial options for these new configurations. Additional clarifications are provided throughout the document to address test features and compatibility across generations of HBM components.

View at TechPowerUp Main Site

 

[dinmaster]

Another step in my imagination towards amd graphic cards possibly going infinity fabric to have a epyc like gpu where 4 gpu cores in a single die running as one. I can't wait for this to happen still crossing fingers. Wouldn't that be great?

 

[Assimilator]

So is this HBM3, or HBM2.5? I'm thinking the latter as this is "only" a 20% speed increase over HBM2.

 

[seronx]

So is this HBM3, or HBM2.5? I'm thinking the latter as this is "only" a 20% speed increase over HBM2.

I think it is called HBM2e.

 

[FordGT90Concept]

So mostly just higher density so they can get more GiBs packed into fewer pins.

 

[Prima.Vera]

Another step in my imagination towards amd graphic cards possibly going infinity fabric to have a epyc like gpu where 4 gpu cores in a single die running as one. I can't wait for this to happen still crossing fingers. Wouldn't that be great?

Definetly that is going to be the next step since bellow 7nm is kind of game over. Too bad the power consumption it will go above the roof...

 

[R-T-B]

in a single die

don't you mean 4 chips across multiple dies? That's kind of Infinity Fabrics point...