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With its IMFlash Technology joint-venture with Micron coming to an end, Intel is finding itself with manufacturing challenges for its memory businesses. The company holds IP to both 3D NAND flash and its own invention 3D XPoint memory, which it believes will succeed NAND flash in performance and endurance. The company is now mulling to move manufacturing of 3D XPoint to a foundry in China. Intel currently manufactures this exotic new memory at an IMFlash Technology facility in Utah. Intel's $1.3 billion stake-sale to Micron pushes it out of this facility.
Under the terms of the stake-sale, Micron allows Intel to continue to manufacture 3D XPoint at IMFlash for a year, after which it must manufacture it elsewhere. The transfer of stake is scheduled for October 31st, which means Intel's manufacturing in Utah will continue till October 2020. In the meantime, Intel is planning to move manufacturing to its Fab 68, located in Dalian, China. Intel is now manufacturing 1st and 2nd generation 3D Xpoint, while its 3rd generation is under development, and was earlier slated for initial manufacturing at Intel's Fab 11X in New Mexico, USA. It's not known if Intel has changed these plans. 3rd generation 3D XPoint hits mass-production in 2021.
View at TechPowerUp Main Site
Under the terms of the stake-sale, Micron allows Intel to continue to manufacture 3D XPoint at IMFlash for a year, after which it must manufacture it elsewhere. The transfer of stake is scheduled for October 31st, which means Intel's manufacturing in Utah will continue till October 2020. In the meantime, Intel is planning to move manufacturing to its Fab 68, located in Dalian, China. Intel is now manufacturing 1st and 2nd generation 3D Xpoint, while its 3rd generation is under development, and was earlier slated for initial manufacturing at Intel's Fab 11X in New Mexico, USA. It's not known if Intel has changed these plans. 3rd generation 3D XPoint hits mass-production in 2021.
View at TechPowerUp Main Site