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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel's unique processor, code-named "Lakefield," that features an industry-first architecture combining a hybrid CPU with Intel's Foveros 3D packaging technology. It offers device-makers more flexibility to innovate on design, form factor and experience.
"The innovation we've achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft's Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem," said Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.
Surface Neo is the culmination of deep engineering collaboration between Intel and Microsoft to drive innovation in new form factors, such as dual-screen devices. It exemplifies the companies' shared vision of advancing the PC industry by delivering remarkable new usages and experiences without compromising on performance, design and the full Windows experience.
Leveraging Intel's latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in package area - a miniscule 12x12x1 mm - that is necessary for pushing the limits of form factor design. Its hybrid CPU architecture combines power efficient "Tremont" cores with a performance scalable "Sunny Cove" core to deliver computing performance and next-generation graphics at low power for long battery life. Lakefield is symbolic of the strategic shift in Intel's design and engineering model that underpins the company's future product roadmaps: enabling workload-optimized PC platforms through the right mix of leadership performance, architectures, manufacturing technologies and intellectual properties.
In addition, Microsoft announced new Surface devices based on 10th Gen Intel Core processors: the Surface Pro 7 and the Surface Laptop 3. The new Surface devices bring the intelligent performance, rich and immersive Intel Iris Plus graphics experience and best-in-class connectivity1 of 10th Gen Intel Core to consumers and businesses in beautiful premium designs.
The new Surface devices are based on 10th Gen Intel Core processors, code-named "Ice Lake." Both are available for pre-order today in select markets.
View at TechPowerUp Main Site
"The innovation we've achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft's Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem," said Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.
Surface Neo is the culmination of deep engineering collaboration between Intel and Microsoft to drive innovation in new form factors, such as dual-screen devices. It exemplifies the companies' shared vision of advancing the PC industry by delivering remarkable new usages and experiences without compromising on performance, design and the full Windows experience.
Leveraging Intel's latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in package area - a miniscule 12x12x1 mm - that is necessary for pushing the limits of form factor design. Its hybrid CPU architecture combines power efficient "Tremont" cores with a performance scalable "Sunny Cove" core to deliver computing performance and next-generation graphics at low power for long battery life. Lakefield is symbolic of the strategic shift in Intel's design and engineering model that underpins the company's future product roadmaps: enabling workload-optimized PC platforms through the right mix of leadership performance, architectures, manufacturing technologies and intellectual properties.
In addition, Microsoft announced new Surface devices based on 10th Gen Intel Core processors: the Surface Pro 7 and the Surface Laptop 3. The new Surface devices bring the intelligent performance, rich and immersive Intel Iris Plus graphics experience and best-in-class connectivity1 of 10th Gen Intel Core to consumers and businesses in beautiful premium designs.
The new Surface devices are based on 10th Gen Intel Core processors, code-named "Ice Lake." Both are available for pre-order today in select markets.
- The Surface Pro 7 was redesigned from the inside out, offering great performance and improved graphics with the versatility of a 2 in 1 form factor.
- Surface Laptop 3 delivers style and speed with a 13.5-inch display and new colors and finishes.
View at TechPowerUp Main Site
