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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
AMD is expected to support the next-generation DDR5 memory standard by 2022, according to a MyDrivers report citing industry sources. We are close to a change in memory standards, with the 5-year old DDR4 memory standard beginning a gradual phase out over the next 3 years. Leading DRAM manufacturers such as SK Hynix have already hinted mass-production of the next-generation DDR5 memory to commence within 2020. Much like with DDR4, Intel could be the first to market with processors that support it, likely with its "Sapphire Rapids" Xeon processors. AMD, on the other hand, could debut support for the standard only with its "Zen 4" microarchitecture slated for 2021 technology announcements, with 2022 availability.
AMD "Zen 4" will see a transition to a new silicon fabrication process, likely TSMC 5 nm-class. It will be an inflection point for the company from an I/O standpoint, as it sees the introduction of DDR5 memory support across enterprise and desktop platforms, LPDDR5 on the mobile platform, and PCI-Express gen 5.0 across the board. Besides a generational bandwidth doubling, PCIe gen 5.0 is expected to introduce several industry-standard features that help with hyper-scalability in the enterprise segment, benefiting compute clusters with multiple scalar processors, such as AMD's CDNA2. Intel introduced many of these features with its proprietary CXL interconnect. AMD's upcoming "Zen 3" microarchitecture, scheduled for within 2020 with market presence in 2021, is expected to stick with DDR4, LPDDR4x, and PCI-Express gen 4.0 standards. DDR5 will enable data-rates ranging between 3200 to 8400 MHz, densities such as single-rank 32 GB UDIMMs, and a few new physical-layer features such as same-bank refresh.
View at TechPowerUp Main Site
AMD "Zen 4" will see a transition to a new silicon fabrication process, likely TSMC 5 nm-class. It will be an inflection point for the company from an I/O standpoint, as it sees the introduction of DDR5 memory support across enterprise and desktop platforms, LPDDR5 on the mobile platform, and PCI-Express gen 5.0 across the board. Besides a generational bandwidth doubling, PCIe gen 5.0 is expected to introduce several industry-standard features that help with hyper-scalability in the enterprise segment, benefiting compute clusters with multiple scalar processors, such as AMD's CDNA2. Intel introduced many of these features with its proprietary CXL interconnect. AMD's upcoming "Zen 3" microarchitecture, scheduled for within 2020 with market presence in 2021, is expected to stick with DDR4, LPDDR4x, and PCI-Express gen 4.0 standards. DDR5 will enable data-rates ranging between 3200 to 8400 MHz, densities such as single-rank 32 GB UDIMMs, and a few new physical-layer features such as same-bank refresh.
![](https://www.techpowerup.com/img/IieRaD1F5BlS9ugj_thm.jpg)
View at TechPowerUp Main Site