• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

ASML Ships Multi-Beam Inspection Tool for 5 nm

AleksandarK

News Editor
Staff member
Joined
Aug 19, 2017
Messages
2,459 (0.94/day)
ASML Holding NV (ASML) today announced that it has completed system integration and testing of its first-generation HMI multibeam inspection (MBI) system for 5 nm nodes and beyond. The HMI eScan1000 demonstrated successful multibeam operation, simultaneously scanning nine beams on a number of test wafers. With nine beams, the eScan1000 will increase throughput up to 600% compared to single e-beam inspection tools for targeted in-line defect inspection applications.

The new MBI system includes an electron optics system capable of creating and controlling multiple primary electron beamlets and then collecting and processing the resulting secondary electron beams, limiting beam-to-beam crosstalk to less than 2% and delivering consistent imaging quality. It also features a high-speed stage to increase the system's overall throughput and a high-speed computational architecture to process the streams of data from the multiple beamlets in real time.



"As critical dimensions continue to shrink with each new technology, 'killer' defects are becoming smaller and smaller, reaching the point where many are no longer detectable with optical inspection," says Gary Zhang, vice president of HMI Product Marketing at ASML. "Our new multibeam inspection system is able to detect these smaller defects, while addressing previous e-beam throughput constraints to make it more suitable for high-volume manufacturing environments."

By offering a range of beam currents, the eScan1000 is suitable for both physical defect inspection and voltage contrast inspection. This allows customers to target a wide range of defect types both in R&D for process development and high-volume manufacturing for excursion monitoring.

Additionally, its proprietary Supernova die-to-database defect detection capability enables chipmakers to monitor for defects on EUV masks using wafer print checks. It detects defects overlooked by optical inspection systems in a fraction of the time that it takes single e-beam solutions for high-volume manufacturing to do so.

The first multibeam inspection system has shipped to a customer this week for qualification. ASML plans to increase the number of beams and beam resolution for future generations to align with chipmakers' product roadmap requirements.

View at TechPowerUp Main Site
 

Solaris17

Super Dainty Moderator
Staff member
Joined
Aug 16, 2005
Messages
26,664 (3.81/day)
Location
Alabama
System Name RogueOne
Processor Xeon W9-3495x
Motherboard ASUS w790E Sage SE
Cooling SilverStone XE360-4677
Memory 128gb Gskill Zeta R5 DDR5 RDIMMs
Video Card(s) MSI SUPRIM Liquid X 4090
Storage 1x 2TB WD SN850X | 2x 8TB GAMMIX S70
Display(s) Odyssey OLED G9 (G95SC)
Case Thermaltake Core P3 Pro Snow
Audio Device(s) Moondrop S8's on schitt Modi+ & Valhalla 2
Power Supply Seasonic Prime TX-1600
Mouse Lamzu Atlantis mini (White)
Keyboard Monsgeek M3 Lavender, Akko Crystal Blues
VR HMD Quest 3
Software Windows 11 Pro Workstation
Benchmark Scores I dont have time for that.
That thing looks cool.
 
Joined
Jun 3, 2010
Messages
2,540 (0.48/day)
The climactic use of the 'beam' word was for the most inundating part.
Does that mean it works like light diffraction microscopy? 9 beams is hard to even describe...
 
Top