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Chinese Manufacturer ProArtist Solves AM4 CPU Mounting Problem with New IFE2 Bracket

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The AMD consumer platform has long used PGA design chips, and this is no different with the AM4 platform. While this design reduces motherboard costs it comes with an unfortunate downside, PGA processors have a habit of sticking to the heatsink when attempting to remove or replace your heatsink. This problem is so commonplace that AMD has published guides online outlining the correct heatsink removal process which involves "twisting the CPU cooler clockwise and counterclockwise to loosen the seal between the heatsink and the lid of the CPU".

Chinese manufacturer ProArtist has created an ingenious solution, the IEF2 AM4 CPU mounting bracket. The bracket replaces the included mounting hardware on motherboards replacing it with spacers secured to a metal mounting place which heatsinks can then be attached to. This bracket ensures that the CPU won't be damaged when removing heatsinks. The bracket is non-standard so only compatibility with ProArtist coolers such as the DESSERTS3 is guaranteed. The IEF2 AM4 CPU mounting bracket is available only in China from Taobao for less than 5 USD.



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Because it is really hard to turn on the PC and put some head in the CPU to soften the thermal paste.
 
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Misleading title tbh
 
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WTF?

This is no different than what every cooler manufacturer does.

How on Earth is this news?
 

W1zzard

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This is no different than what every cooler manufacturer does.
Read the post, it locks the CPU down in the socket, so you can't rip it out when you remove the cooler
 
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WTF?

This is no different than what every cooler manufacturer does.

How on Earth is this news?
See the black part that goes around the cpu?
 
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I'll be honest I've broken 1 motherboard socket, because of something like that. It was a Gigabye Am3+ ud9 rev 1.0, no load line calibration. I twisted it to remove my Mugen 2 when I heard a a noise. Thinking the gap much finally gave from the cpu IHS. Much to my dismay to see the black socket piece around the bottom of the cpu. Luckily the board was so terrible with voltage droop they made a rev 2.0 which had Load line calibration. Ironically with the same cpu was, also the one only the cpu I manage to kill later. Fx8120 it went pop in the board at one point. Next boot later dead cpu.
 
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pretty cool but what I dont get is that AMD cant just have a hold down plate on the motherboard, just like intel has.
 
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pretty cool but what I dont get is that AMD cant just have a hold down plate on the motherboard, just like intel has.

Intel never had a hold down plate on their PGA sockets either.
 

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Honestly, i'd be up for something like this if it was compatible with the standard AM4 clips and added something new as well (ability to rotate them? tighter pressure, RGB bling whatever)
 
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If the bracket was coming from a known manufacturer, it would probably cost $30.

But really now, if someone is in hardware news to know about this bracket's existance, probably knows how to remove the heatsink without popping out the CPU too.
 

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That was my nightmare on sFM2+. Not because of my lack of patience, but mostly from customers trying to change TIM and killing MoBo in the process. I still have 5-6 boards in the office with shredded socket internals. I think the main issue is not sticky TIM, but rather the quality of socket itself, just like with easily bent pins on LGA115x.
But either way, that's a neat solution. Only compatible with few chinese cooling solutions, but at least for those they've bundled smaller standoffs to compensate for that 1-2mm of extra thickness on the bracket.
 
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This is a dangerous concept, because it does not secure IHS like the LGA socket does. In case of too great pull force you will rip away the soldered die along with the IHS as there is nothing holding IHS back.
 
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This is a dangerous concept, because it does not secure IHS like the LGA socket does. In case of too great pull force you will rip away the soldered die along with the IHS as there is nothing holding IHS back.
Are you actually suggesting that dry thermal paste can create a stronger bond than solder?

Oh dear.

As for this bracket: while I kind of see its utility, I have trouble understanding how difficult it is to twist the cooler a bit back and forth to get the TIM to let go.
 
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Read the post, it locks the CPU down in the socket, so you can't rip it out when you remove the cooler

I read "This bracket ensures that the CPU won't be damaged when removing heatsinks" and looked at the thumbnails and couldn't see anything different. That's because they chose to showcase their black bracket against a black motherboard...

But mea culpa, I should've looked closer. I do believe, however, that something in the news piece specifically calling this out would've been helpful, like:

Chinese manufacturer ProArtist has created an ingenious solution, the IEF2 AM4 CPU mounting bracket. While at first glance it looks like any other third-party CPU cooler mount, a closer look shows an additional bracket below the mounting plate, that surrounds the CPU IHS and holds it fast in the socket. This bracket ensures that the CPU won't be damaged when removing heatsinks. The bracket is non-standard so only compatibility with ProArtist coolers such as the DESSERTS3 is guaranteed. The IEF2 AM4 CPU mounting bracket is available only in China from Taobao for less than 5 USD.

(feel free to use the above if you want)

Honestly, i'd be up for something like this if it was compatible with the standard AM4 clips and added something new as well (ability to rotate them? tighter pressure

Yes!

RGB bling

NO

Are you actually suggesting that dry thermal paste can create a stronger bond than solder?

I mean, technically superglue can be used as thermal paste. :p
 
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Apart from the black AM4 part, it appears to be a Universal mounting bracket.
 
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Intel never had a hold down plate on their PGA sockets either.

well no thats not my point, the difference between pga and lga is where the pins are.
That does not mean a PGA socket could not also just have a hold-down plate, this is not rocketscience.
 
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a hammer and a chisel will remove fast any sticking cooler....
 
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Read the post, it locks the CPU down in the socket, so you can't rip it out when you remove the cooler

So instead of stressing the pins, stressing the the substrate and package is better? Instead of ripping the cpu out of the socket the witless will just be trying to rip the IHS off the CPU. It just becomes a matter of what gives out first paste or the substrate. This is a stupid idea too wrapped up on how clever it thinks it is.

Because it is really hard to turn on the PC and put some head in the CPU to soften the thermal paste.

I came here just to post this.
 
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Are you actually suggesting that dry thermal paste can create a stronger bond than solder?

Oh dear.

As for this bracket: while I kind of see its utility, I have trouble understanding how difficult it is to twist the cooler a bit back and forth to get the TIM to let go.
Yes, but it's not the TIM itself, but the vacuum force.
Yes, it is possible to tear the rtv adhesive using vacuum force only. This is why ZIF AM4 socket doesn't have this. And this is why LGA socket CPUs have a flange on the IHS, rather than to make contact on the organic substrate.
 
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If the bracket was coming from a known manufacturer, it would probably cost $30.
Yes, wouldn't it be nice if cooler manufacturer's didn't try to fleece you at every turn :shadedshu:
So instead of stressing the pins, stressing the the substrate and package is better? Instead of ripping the cpu out of the socket the witless will just be trying to rip the IHS off the CPU.
When was the last time you saw someone rip an IHS off their CPU, if ever?
 
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Never had this problem on AM4 just a little heat in the system and a bit of a twist on the cooler and it comes right off.
 

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Because it is really hard to turn on the PC and put some head in the CPU to soften the thermal paste.

That didn't work for me. I had my PC up and running for several HOURS before powering down to change from the stock cooler to a Noctua cooler: was missing the AM4 mounting kit, which is why i didn't use it from the start.

Result: the CPU got yanked right out of the socket.
 
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When was the last time you saw someone rip an IHS off their CPU, if ever?
He is right. I may or may not come from electrical interconnect industry and this is a fact. The heatspreader would need to have flange edge in order for bolt down retention ring to be doing its job, otherwise the stress is applied to the MCU, solder and glue instead of the head spreader. This would never go past EVT stage at any interconnect factory.
 
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