Sorry, but who is calling who names exactly? I would recommend you reread each of our previous posts and get back to me with an answer to that question, as either your reading comprehension or your understanding of the term "calling someone names" is sorely lacking. Have I described your behaviour here in rather unflattering terms? Absolutely. I fully stand behind those descriptions, as they are entirely supported by your previous posts. You, on the other hand, have a) called me names, and b) refused to argue for your claims here, instead claiming that we should accept your word as truth based on... well, again, posturing. You have given us zero reason to believe what you are saying, beyond attempts to belittle me, deflect arguments, claim some secret and innate authority, and generally argue in bad faith. The onus is purely on you to change that, as you are the one bringing something to the debate that actually needs proving.
As to the rest of what you are saying: I would be asking that mechanical engineer what sort of thermal paste they are using in their models, as they might have mistakenly used numbers for a thermal adhesive instead. Even with fatigue due to thousands or hundreds of thousands of thermal cycles, there is no way the solder bonds will weaken beyond the strength of the thermal paste. Enough for one or a few bonds to break (even without mechanical stress) and render the CPU not working? Sure, that can likely theoretically happen (though it's highly unlikely to happen in practice - if this was common CPUs failing with age would itself be common, which it isn't), but that is in no way the same as the die or IHS being ripped off by the IHS sticking to the cooler. Which, to remind you, was what you said. Given that your statement is the one requiring the most new assumptions - namely, that dried up thermal paste can create a vacuum force strong enough to fully break even a severely weakened solder bond between either a <100mm2 CPU die and its IHS or the bottom of the die and its <1000 solder points connecting it to the substrate - the onus of proof falls on you. If not, your statement fails the simple test of Ockham's razor.
I also don't see what criminal law jurisdiction has to do with this. As I said, NDAs are purely a matter of civil law. Breaking an NDA is not a crime, but a breach of contract, for which you can be sued in civil court. Industrial espionage can fall under criminal law, but breaching an NDA is not equal to industrial espionage by a long shot. And if what you are saying was actually true, you know these forums have a DM function, right? You could make your argument there, we could delete the messages afterwards, and nobody would be any wiser except that you would actually be able to make your case, and I would gladly admit I was wrong here. But I strongly suspect you don't actually have a case to make at all.
And lastly, what does the Eurovision Song Contest have to do with thermal stress in solder joints? (I guess I have to point this out, but that is what you call a joke.)
