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| System Name | RyzenGtEvo/ Asus strix scar II |
|---|---|
| Processor | Amd R5 5900X/ Intel 8750H |
| Motherboard | Crosshair hero8 impact/Asus |
| Cooling | 360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK |
| Memory | Gskill Trident Z 3900cas18 32Gb in four sticks./16Gb/16GB |
| Video Card(s) | Asus tuf RX7900XT /Rtx 2060 |
| Storage | Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme |
| Display(s) | Samsung UAE28"850R 4k freesync.dell shiter |
| Case | Lianli 011 dynamic/strix scar2 |
| Audio Device(s) | Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset |
| Power Supply | corsair 1200Hxi/Asus stock |
| Mouse | Roccat Kova/ Logitech G wireless |
| Keyboard | Roccat Aimo 120 |
| VR HMD | Oculus rift |
| Software | Win 10 Pro |
| Benchmark Scores | laptop Timespy 6506 |
I personally would expect AMD to absolutely use Samsung at some point to reduce the choke but think they'll design something for Samsung's nodes, despite similarity in nodes I doubt that their present design's would translate well to Samsung however the new console's will be updated quite regularly even while staying identical in specs etc, all to reduce BOM costs, this is the way.
Or the extra chips could be supportive chips like the recent ML chiplet or Io die.
That aligns quite well with this news but it is. Just an opinion.
Or the extra chips could be supportive chips like the recent ML chiplet or Io die.
That aligns quite well with this news but it is. Just an opinion.