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Today, Mr. Raja Koduri, senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel, has teased Intel's upcoming Xe-HPG (DG2) gaming GPU on Twitter. Sharing a die shot of Intel's Xe-HPG design with 512 Execution Units (EUs), Mr. Koduri has highlighted the progress that the company is currently going through. The Xe-HPG will represent the company's efforts of going into a very competitive discrete GPU market, dominated by a duopoly of AMD and NVIDIA. The Xe-HPG design pictured below is representative of a maxed-out SKU with 512 EUs, translating into 4096 shading units. This model is expected to be paired with 16 GB of GDDR6 memory.
"From jittery journeys to buttery smooth" - it is quoted in a Tweet of Mr. Koduri. This doubles down on the efforts Intel is putting into creating a GPU and the difficulties that the company is facing. It is also noted that there remains a lot of work in form of driver coding and a lot of game optimizations, which are very important for the new GPU. You can check out the complete Tweet below.
Update 07:55 UTC: According to @_rogame, who has performed calculations of die size by placing the image in the leaked PCB scheme of the DG2 designs, we have information about rough die size. The estimations are currently that the die is measured at 22.3 mm lenght and 8.5 mm width, resulting in 190 mm² area.
View at TechPowerUp Main Site
"From jittery journeys to buttery smooth" - it is quoted in a Tweet of Mr. Koduri. This doubles down on the efforts Intel is putting into creating a GPU and the difficulties that the company is facing. It is also noted that there remains a lot of work in form of driver coding and a lot of game optimizations, which are very important for the new GPU. You can check out the complete Tweet below.
Raja Koduri said:Xe-HPG (DG2) real candy - very productive time at the Folsom lab couple of weeks ago. "From jittery journeys to buttery smooth" said @rogerdchandler - lots of game and driver optimization work ahead for @gfxlisa's software team. They are all very excited..and a little scared
Update 07:55 UTC: According to @_rogame, who has performed calculations of die size by placing the image in the leaked PCB scheme of the DG2 designs, we have information about rough die size. The estimations are currently that the die is measured at 22.3 mm lenght and 8.5 mm width, resulting in 190 mm² area.
View at TechPowerUp Main Site