• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

European Processor Initiative (EPI) Completes Phase One of The Project

AleksandarK

News Editor
Staff member
Joined
Aug 19, 2017
Messages
2,870 (1.04/day)
The European Processor Initiative (EPI), a project with 28 partners from 10 European countries aiming to make the EU achieve independence in high-performance computing (HPC) chip technologies and infrastructure, is proud to present key results achieved in phase one (2018-2021).

These results stem from three major research and innovation domains, the General-Purpose Processor (GPP), Accelerator (EPAC) and Automotive streams, complemented by a number of common activities.



General-Purpose Processor (GPP)
Atos, a global leader in digital transformation, cybersecurity, cloud and HPC, is the lead partner of the General-Purpose Processor (GPP) stream. Together with SiPearl, the company bringing to market the high-performance and low-power European processor, and other EPI partners, they defined the architectural specifications of Rhea, the first generation of the EPI General-Purpose Processor (GPP) implementation and its future derivates.

With 29 RISC-V cores, the Arm Neoverse V1 architecture used by SiPearl to design Rhea will offer an effective, scalable and customisable solution for HPC applications. Architectural decisions were taken following a co-design methodology and by analysing the performance of advanced intellectual property (IP) blocks. A scalable network-on-chip (NoC) to enable high-frequency, high-bandwidth data transfers between cores, accelerators, input / output (IO) and shared memory resources was also optimised by SiPearl.

To allow early software development and performance estimation of the EPI processor while the GPP was still at the implementation stage, a GPP virtual prototype was designed and used.

"We are proud of our success in designing a powerful GPP leveraging cutting edge technologies and IPs built and deployed exclusively by European universities and industrial leaders. We are confident that we will soon demonstrate the instrumental role of this GPP in enabling a European exascale computing machine, the next breakthrough in the HPC domain the world is expecting." - said Stream Leader Emmanuel Ego (Atos).

"At SiPearl, we are very proud to bring to life the joint project of the European Processor Initiative. We worked hard through close collaboration with the initiative's 28 partners - the scientific community, supercomputing centres, leading names from industry and innovative start-ups - who are our stakeholders, future users, and clients. With the release of the Rhea processor, we will all contribute to ensure European sovereignty in HPC applications such as personalised medicine, climate modelling, and energy management." - said Philippe Notton, founder and CEO of SiPearl.

Rhea will integrate technologies by EPI partners and offers unique features in terms of memory architecture, memory bandwidth optimisation, security, and power management.

Memory
Memory controllers are one of the most critical IPs when it comes to GPP performance. To help evaluate architectural choices, CEA developed a complete simulation platform with specific instrumentations to analyse controller efficiency in driving the high-bandwidth HBM2E memories. The platform allows efficient analysis of the memory device interface thanks to the decoding and tracking of all memory commands and data. The HBM2E subsystem was simulated with multiple random and directive patterns targeting different traffic shapes and involving all the controller features in maintaining the HBM2E efficiency.

Security
A number of state-of-the-art embedded security features and key technologies were also designed in this stream. These include the standalone Security Management System (SMS) security IP developed by ProvenRun, providing advanced, common-criteria certified, sovereign security IP for HPC and edge processors.

To further bolster security, the University of Pisa contributed a set of crypto IPs, called "Crypto Tile", integrated in the Rhea GPP by SiPearl. This provides a hardware security module with full security services for high-end symmetric (AES with 9 cipher modes), asymmetric (ECC, ECDSA, ECIES, ECDH) and hashing (SHA2/SHA3) cryptography, delivering several orders of magnitude of increased throughput and decreased energy cost as compared to a software solution.

The Crypto Tile also includes secure key storage and secure IP configuration, side-channel attack protection, on-chip true random number generation (TRNG), support of Linux kernel drivers, extreme key lengths for maximum security levels and high speed en(de)cryption throughput thanks to AXI4-based interface towards DMA and Arm or RISC-V programmable cores. Post-quantum cryptographic support is also provided thanks to real-time implementation of Lattice algorithms such as Crystals Kyber and Dilithium.

Power
Given the importance both of reducing the carbon footprint of future generation computing systems and enabling higher computation capabilities in post-Dennard scaling electronics, energy-efficient computing has been a key consideration in EPI from the outset. For this purpose, an open-source, RISC-V based power controller was designed by University of Bologna and ETH Zurich and integrated into the Rhea processor, harnessing advanced control and artificial intelligence (AI) algorithms for the power management of large-scale systems-on-chip (SoCs).

In addition, based on STMicroelectronics technology on power solutions, Atos and E4 Computer Engineering designed and manufactured the Voltage Regulator and Management reference platform to test the Board Management Controller (mapped inside a field-programmable gate array, or FPGA).

EPI GPP has achieved register transfer level (RTL) completion status as a result of the first phase of the EPI project. The Rhea full design implementation is currently at the validation stage using emulations.

The main result of general-purpose processor activities in EPI phase one, the Rhea processor, will be instrumental for the launch of European exascale supercomputers in 2023.

Accelerators
The EPI accelerator stream set out to deliver energy-efficient acceleration for HPC and AI workloads. With the European Processor Accelerator (EPAC) test chip proof of concept, EPI has demonstrated that it is possible to create an exclusively European design, while the use of open-source instruction-set architectures (ISAs) ensures freedom from proprietary licences and export restrictions.

This stream has fully embraced the open-source philosophy of give and take, contributing to the expansion of the RISC-V ecosystem and adding to the LLVM compiler database. The EPAC systems and FPGA software development vehicles make full use of the Linux operating system and contribute to the community with patches, device drivers, and additional functionality to popular open-source HPC software packages such as OpenMP and MPI. Furthermore, parts of the hardware such as the STX (stencil/tensor accelerator) were developed using a permissively licensed open-source approach around the PULP platform.

"The accelerator stream in EPI has emphatically proven that the RISC-V vector approach has the potential to transform the HPC sector, with designed-in-Europe architectures capable of delivering high performance on a low energy budget," commented Stream Leader Jesús Labarta (Barcelona Supercomputing Center). "The work also epitomizes European traditions of open science and collaboration. Partners across Europe have joined forces to create something that no single organization could have achieved by itself. By working with open-source technologies and projects, the EPAC stream has helped expand the RISC-V ecosystem, making this technology viable for an increasing number of applications in the future."

EPAC set out to provide a proof of concept for European-designed, RISC-V vector architectures for HPC acceleration. A suite of technologies has been developed to this end:
  • The EPAC vector processing unit (VPU), design by BSC and UNIZG, shows the use of RISC-V long-vector architectures for high-performance computing is a viable approach, delivering high performance on a low energy budget, and that it can be scaled up in future.
  • The vector unit is driven by Semidynamics' vector-specialised Avispado RISC-V core and Gazzillion Misses technology for energy-efficient processing.
  • The dedicated and flexible RISC-V based many-core stencil and tensor accelerator (STX), designed by ETH Zurich and Fraunhofer, leverages stencil processing units to offer exceptional energy efficiency and programmability for machine-learning and stencil workloads.
  • Meanwhile, the variable precision accelerator (VRP), designed by CEA, enhances efficiency and reliability for scientific high-performance computing applications such as multiphysics simulations.
  • The EPAC test chip also includes multiple distributed banks of shared L2 cache and coherence home nodes (L2HN) designed by FORTH and CHALMERS and optimised for the high-bandwidth requirements of the vector processing units while offering a coherent view of the memory system that facilitates multi-core programmability.
  • All the processing units and the shared L2HN banks are connected via a high-speed NoC in a modular manner that permits the system to scale up. The test chip also includes advanced SERDES technology for very high-bandwidth off-chip and cross-chip communication. Both the NoC and SERDES were designed by Extoll.
  • The PCB (daughter board) to enable the testing of the EPAC Test Chip was designed and developed by E4 Computer Engineering.
  • EPAC offers exceptional programmability, with generic codes being run successfully on the test chip with minimal modifications and a software development vehicle to support programmers. It is a genuine example of co-design, with a continuous integration system and rapid application of improvements in response to feedback.

Automotive
Coordinated by Infineon, a leader in automotive microcontrollers, the Automotive Stream has paved the way towards road-capable autonomous cars, thanks to the proof of concept for an innovative embedded high-performance compute (eHPC) platform and associated software development kit (SDK). This platform, in combination with a downsized, vehicle-tailored, general-purpose processor, meets the increasing demand for computing power in future cars in a cost-efficient, economically viable and functionally safe way.

"Overall, the achievements are evidence of collaboration, synergies and the team spirit which characterised the research work in the automotive stream", - said Stream Leader Knut Hufeld (Infineon). "With its focus on cost-effective, safe and certified automotive solutions, it can be seen as a driving belt for the overall profitability of European processors in the field of HPC."



The main achievement was demonstrated in a road-approved BMW X5 car to show the proof of concept for a pioneering eHPC Microcontroller Unit (eHPC MCU) which is integrated in a specially designed flexible modular computing platform (MCP) together with several EPI technology IPs. Numerous test drives were performed to collect data and evaluate test scenarios involving parameters of autonomous driving.

Among other features, the platform includes AI-supported integrated cameras and Elektrobit radar imaging analysis software, with integrated preparation for use of EPI accelerators in the system. It is the result of a close cooperation among the 16 partners in Stream4 aiming to fulfil its objectives of specifying a suitable eHPC Platform, define its architecture and develop the necessary software development kit (SDK).

Infineon also expanded the automotive microcontroller in terms of its architecture and performance ability so that it can act as master and control one or several accelerators. Relevant aspects were safety, security, fall back or redundancy for reduced application, with regard to the top Automotive Safety Integrity Level D (ASIL D) at system level, which is required for autonomous driving applications.

The platform is scalable and open for further technologies. The MCP has various slots for other technologies developed as part of EPI, including:
  • future automotive versions of the EPI general purpose processor
  • the EPAC RISC-V based accelerator
  • the Kalray Massively Parallel Processor Array (MPPA ) accelerator tile for eHPC, developed as an IP in the Stream 2 and demonstrated for object detection using Kalray's MPPA -based Coolidge processor for final BMW automotive demonstration
  • the Menta eFPGA
  • Test runs reveal that EPI now has specific technologies suitable for autonomous driving up to at least level 4 - where the vehicle drives independently most of the time - thus paving the way for the future.

In addition to the hardware platform, this stream also included the development of a complete software ecosystem, based to a large extent on software products by automotive software specialist Elektrobit. This area also comprises the automotive eHPC platform software stack, including the classic automotive open operating system architecture (AUTOSAR) development for Auto eHPC MCUs, and the adaptive AUTOSAR development for HPC GPPs and the L4Re hypervisor (virtualisation) that are crucial for automotive applications.

With regard to safety, a specific concept was jointly created for a software lockstep, thus contributing to an overall EPI safety concept.

After this three-year initial phase, the results and findings will be continued in further projects.

Common Activities
This stream acted as a provider for other technical streams. Excellent collaboration, both internally and with other streams, helped mitigate issues caused by pandemic-imposed travel restrictions and allowed the stream to meet its objectives, enumerated below.

This stream established a co-design process to shape the design of European processors. Simulations and models with different levels of detail and precision were created to identify the impact of design decisions on the performance of future applications. A benchmark suite of over 40 applications was used to support co-design and later evaluate the EPI processors. Applications have also been prepared to run on future EPI systems, by adapting and testing them on comparable hardware platforms and emulators.

The specification of a "common platform" architecture was defined and used as a backbone for architecture exploration, as the starting point for the GPP implementation, and to define guidelines for security and heterogeneous integration.

Another major result was the integration of the power management design in the GPP specifications: power management firmware, off-chip integration consolidating power distribution board design, PLDA integration, and consolidation of the power management hardware integration.

Work was also done on multiple aspects of the support of system software development: general and hybrid programming environments, OpenMP and MPI runtimes on both GPP and RISC-V sides, OpenMP extra threads support for dynamic load balancing (DLB) and the introspection-based scheduling mechanism in the LLVM OpenMP runtime, offloading for both GCC and LLVM toolchains, testing of power and energy monitoring libraries on available reference ARM Platform, and the resource manager.

Another notable achievement was the development of three tools - gem5, MUSA and SESAM/VPSim - for a complete multi-level simulation environment that provides relevant virtual prototypes for a wide range of needs encountered in the EPI streams. These tools demonstrated broad capabilities, including detailed chiplet- and NoC-level simulation, system simulation for software design, and performance evaluation for design space exploration and hardware co-design activities.

  • JUELICH and FORTH jointly developed a gem5 simulation package of Rhea. This cycle-accurate computer architecture simulator is capable of modelling a variety of hardware platforms. It provides models of varying complexity for CPU cores, memory devices, coherent caches and on-chip networks, which can be combined in a modular fashion.
  • MUSA, from BSC, relies on native execution traces with two levels of detail to allow simulation of different communication networks, numbers of cores per node, and relevant microarchitectural parameters. In addition, MUSA incorporates support for register renaming using a register file of any generic size as well as support for the most advanced cache prefetchers (e.g., BOP, SPP, etc.)
  • The CEA development SESAM/VPSim allows collaborations across multiple work packages by being flexible enough in its capabilities to operate alone, to interface with third-party physical system platforms or simulators, and to be integrated with most of the virtual prototyping methodologies used in the EPI project. Moreover, SESAM/VPSim includes fast on-chip network and cache performance models as well as decoupling the simulation of functional and extra-functional behaviours, resulting in a good compromise between accuracy and simulation time.
  • "I was delighted to take over the management of a successful stream, midway through the project, that was able to provide a very high level of co-design, a comprehensive set of benchmarks, and useful simulation platforms that allowed the project to envision processor architecture, effective power management, and to start delivering libraries fit for the new system. I would like to thank Romain Dolbeau, who started the stream, and all the work package leaders and teams for their passion and kind spirit of collaboration." - said Stream Leader Jean-François Blanc (Atos).

The outlook
"I'm proud of the outstanding results achieved by EPI teams after only three years of cooperation, paving the way towards Europe's technological sovereignty. I'm particularly impressed we delivered our objectives on time with a limited budget, despite the unprecedented working conditions due to the terrible COVID-19 pandemic. This has created favourable conditions for the launch of the next phase and its successful delivery of the European processors and accelerators for the EUPEX (EUropean Pilot for Exascale) and TEP (The European Pilot) projects, the precursors to European exascale systems." - said Eric Monchalin (Atos), chairman of the EPI Board.

View at TechPowerUp Main Site
 
Joined
May 17, 2021
Messages
3,716 (2.65/day)
Processor Ryzen 5 5700x
Motherboard B550 Elite
Cooling Thermalright Perless Assassin 120 SE
Memory 32GB Fury Beast DDR4 3200Mhz
Video Card(s) Gigabyte 3060 ti gaming oc pro
Storage Samsung 970 Evo 1TB, WD SN850x 1TB, plus some random HDDs
Display(s) LG 27gp850 1440p 165Hz 27''
Case Lian Li Lancool II performance
Power Supply MSI 750w
Mouse G502
Going with RISC-V i applaud that. And it wouldn't be Europe if a large focus wouldn't be cars.
 
Last edited:

Space Lynx

Astronaut
Joined
Oct 17, 2014
Messages
17,777 (4.67/day)
Location
Kepler-186f
Processor 7800X3D -25 all core
Motherboard B650 Steel Legend
Cooling Frost Commander 140
Memory 32gb ddr5 (2x16) cl 30 6000
Video Card(s) Merc 310 7900 XT @3100 core -.75v
Display(s) Agon 27" QD-OLED Glossy 240hz 1440p
Case NZXT H710
Power Supply Corsair RM850x
neat more innovation that majority of people won't be able to afford

#future should be hyperloop
 
Joined
Dec 21, 2021
Messages
62 (0.05/day)
I remember back in the 90s some of the biggest semiconductor companies in the world came from Europe. You had giant companies like Siemens and Philips who had their own memory and chip division alongside ST Micro. Little by little they lost ground until it made sense for Philips and Siemens to split off their memory and chip division and the rest is history. Asians took over and now we are at the mercy of companies like TSMC, Samsung and SK. This is ironic but thanks to the Pandemic the leaders of America and Europe have seen how import semiconductors are and how lettings Asia take over creates a massive problem if supply channels are cut because of a Pandemic. Imagine if a big war breaks out in Asia since a lot of countries are spending so much money on weapons.
 
Joined
Jul 16, 2014
Messages
8,241 (2.11/day)
Location
SE Michigan
System Name Dumbass
Processor AMD Ryzen 7800X3D
Motherboard ASUS TUF gaming B650
Cooling Artic Liquid Freezer 2 - 420mm
Memory G.Skill Sniper 32gb DDR5 6000
Video Card(s) GreenTeam 4070 ti super 16gb
Storage Samsung EVO 500gb & 1Tb, 2tb HDD, 500gb WD Black
Display(s) 1x Nixeus NX_EDG27, 2x Dell S2440L (16:9)
Case Phanteks Enthoo Primo w/8 140mm SP Fans
Audio Device(s) onboard (realtek?) - SPKRS:Logitech Z623 200w 2.1
Power Supply Corsair HX1000i
Mouse Steeseries Esports Wireless
Keyboard Corsair K100
Software windows 10 H
Benchmark Scores https://i.imgur.com/aoz3vWY.jpg?2
I remember back in the 90s some of the biggest semiconductor companies in the world came from Europe. You had giant companies like Siemens and Philips who had their own memory and chip division alongside ST Micro. Little by little they lost ground until it made sense for Philips and Siemens to split off their memory and chip division and the rest is history. Asians took over and now we are at the mercy of companies like TSMC, Samsung and SK. This is ironic but thanks to the Pandemic the leaders of America and Europe have seen how import semiconductors are and how lettings Asia take over creates a massive problem if supply channels are cut because of a Pandemic. Imagine if a big war breaks out in Asia since a lot of countries are spending so much money on weapons.
Some countries in Asia have money to spare for a war, just not the right excuse to start one. Asia has been fleecing the rest of the world since their first stolen IP, which is easy since most have population to spare and wages that would make a cockroach go bankrupt. I am glad this plan is going well for the EU, its not likely to happen in the US because of politicians here changing underwear so often ( vote for something one month, and against it the next month).
 
Joined
May 17, 2021
Messages
3,716 (2.65/day)
Processor Ryzen 5 5700x
Motherboard B550 Elite
Cooling Thermalright Perless Assassin 120 SE
Memory 32GB Fury Beast DDR4 3200Mhz
Video Card(s) Gigabyte 3060 ti gaming oc pro
Storage Samsung 970 Evo 1TB, WD SN850x 1TB, plus some random HDDs
Display(s) LG 27gp850 1440p 165Hz 27''
Case Lian Li Lancool II performance
Power Supply MSI 750w
Mouse G502
The US still has Intel, GlobalFoundries, Qualcomn, Marvell and Micron. At least this ones.
 

TheLostSwede

News Editor
Joined
Nov 11, 2004
Messages
18,272 (2.46/day)
Location
Sweden
System Name Overlord Mk MLI
Processor AMD Ryzen 7 7800X3D
Motherboard Gigabyte X670E Aorus Master
Cooling Noctua NH-D15 SE with offsets
Memory 32GB Team T-Create Expert DDR5 6000 MHz @ CL30-34-34-68
Video Card(s) Gainward GeForce RTX 4080 Phantom GS
Storage 1TB Solidigm P44 Pro, 2 TB Corsair MP600 Pro, 2TB Kingston KC3000
Display(s) Acer XV272K LVbmiipruzx 4K@160Hz
Case Fractal Design Torrent Compact
Audio Device(s) Corsair Virtuoso SE
Power Supply be quiet! Pure Power 12 M 850 W
Mouse Logitech G502 Lightspeed
Keyboard Corsair K70 Max
Software Windows 10 Pro
Benchmark Scores https://valid.x86.fr/yfsd9w
neat more innovation that majority of people won't be able to afford

#future should be hyperloop
Huh? It's an SoC. Afaik it's a test chip, to see if a project like this was possible.

I remember back in the 90s some of the biggest semiconductor companies in the world came from Europe. You had giant companies like Siemens and Philips who had their own memory and chip division alongside ST Micro. Little by little they lost ground until it made sense for Philips and Siemens to split off their memory and chip division and the rest is history. Asians took over and now we are at the mercy of companies like TSMC, Samsung and SK. This is ironic but thanks to the Pandemic the leaders of America and Europe have seen how import semiconductors are and how lettings Asia take over creates a massive problem if supply channels are cut because of a Pandemic. Imagine if a big war breaks out in Asia since a lot of countries are spending so much money on weapons.
Philips stuff is mostly part of NXP these days, Siemens is still doing some things, but they seem to have cut back on a lot of their own chips. STM is still around, but seems to focus on the lower-end of things, as they're one of the most popular general purpose MCU choices out there.
None of the Asian companies you mentioned are direct competitors, unless you're talking about pure foundry business.
If a big war breaks out in Asia, we're talking WW3, as it would not be limited to Asia.

The US still has Intel, GlobalFoundries, Qualcomn, Marvell and Micron. At least this ones.
You forgot Nvidia, AMD, Broadcom, ON Semi, TI, Analog Devices, Microchip, Maxim, Cypress and a few others.
 
Joined
Sep 17, 2014
Messages
23,513 (6.13/day)
Location
The Washing Machine
System Name Tiny the White Yeti
Processor 7800X3D
Motherboard MSI MAG Mortar b650m wifi
Cooling CPU: Thermalright Peerless Assassin / Case: Phanteks T30-120 x3
Memory 32GB Corsair Vengeance 30CL6000
Video Card(s) ASRock RX7900XT Phantom Gaming
Storage Lexar NM790 4TB + Samsung 850 EVO 1TB + Samsung 980 1TB + Crucial BX100 250GB
Display(s) Gigabyte G34QWC (3440x1440)
Case Lian Li A3 mATX White
Audio Device(s) Harman Kardon AVR137 + 2.1
Power Supply EVGA Supernova G2 750W
Mouse Steelseries Aerox 5
Keyboard Lenovo Thinkpad Trackpoint II
VR HMD HD 420 - Green Edition ;)
Software W11 IoT Enterprise LTSC
Benchmark Scores Over 9000
neat more innovation that majority of people won't be able to afford

#future should be hyperloop

Why not just straight for Mars then while we're at it? LOL
 
Joined
Sep 28, 2005
Messages
3,411 (0.48/day)
Location
Canada
System Name PCGR
Processor 12400f
Motherboard Asus ROG STRIX B660-I
Cooling Stock Intel Cooler
Memory 2x16GB DDR5 5600 Corsair
Video Card(s) Dell RTX 3080
Storage 1x 512GB Mmoment PCIe 3 NVME 1x 2TB Corsair S70
Display(s) LG 32" 1440p
Case Phanteks Evolve itx
Audio Device(s) Onboard
Power Supply 750W Cooler Master sfx
Software Windows 11

Space Lynx

Astronaut
Joined
Oct 17, 2014
Messages
17,777 (4.67/day)
Location
Kepler-186f
Processor 7800X3D -25 all core
Motherboard B650 Steel Legend
Cooling Frost Commander 140
Memory 32gb ddr5 (2x16) cl 30 6000
Video Card(s) Merc 310 7900 XT @3100 core -.75v
Display(s) Agon 27" QD-OLED Glossy 240hz 1440p
Case NZXT H710
Power Supply Corsair RM850x
Joined
Sep 17, 2014
Messages
23,513 (6.13/day)
Location
The Washing Machine
System Name Tiny the White Yeti
Processor 7800X3D
Motherboard MSI MAG Mortar b650m wifi
Cooling CPU: Thermalright Peerless Assassin / Case: Phanteks T30-120 x3
Memory 32GB Corsair Vengeance 30CL6000
Video Card(s) ASRock RX7900XT Phantom Gaming
Storage Lexar NM790 4TB + Samsung 850 EVO 1TB + Samsung 980 1TB + Crucial BX100 250GB
Display(s) Gigabyte G34QWC (3440x1440)
Case Lian Li A3 mATX White
Audio Device(s) Harman Kardon AVR137 + 2.1
Power Supply EVGA Supernova G2 750W
Mouse Steelseries Aerox 5
Keyboard Lenovo Thinkpad Trackpoint II
VR HMD HD 420 - Green Edition ;)
Software W11 IoT Enterprise LTSC
Benchmark Scores Over 9000
Elon Musk already got that covered sweetie

Riiight but this is a topic about chips.

Yes. It also had pictures of cars in it. Elon Musk has cars covered too :roll: Ironically, the same mind that's behind a hyperloop, which would be at odds with car transportation, according to you o_O
 
Last edited:

Space Lynx

Astronaut
Joined
Oct 17, 2014
Messages
17,777 (4.67/day)
Location
Kepler-186f
Processor 7800X3D -25 all core
Motherboard B650 Steel Legend
Cooling Frost Commander 140
Memory 32gb ddr5 (2x16) cl 30 6000
Video Card(s) Merc 310 7900 XT @3100 core -.75v
Display(s) Agon 27" QD-OLED Glossy 240hz 1440p
Case NZXT H710
Power Supply Corsair RM850x
Riiight but this is a topic about chips.

Yes. It also had pictures of cars in it. Elon Musk has cars covered too :roll: Ironically, the same mind that's behind a hyperloop, which would be at odds with car transportation, according to you o_O

you missed out on my sarcasm, my elon musk comment was a joke. not a fan of the guy personally, he is highly overrated. thats the problem with the internet, hard to read people
 

throwaway27377637

New Member
Joined
Dec 25, 2021
Messages
1 (0.00/day)
Huh? It's an SoC. Afaik it's a test chip, to see if a project like this was possible.


Philips stuff is mostly part of NXP these days, Siemens is still doing some things, but they seem to have cut back on a lot of their own chips. STM is still around, but seems to focus on the lower-end of things, as they're one of the most popular general purpose MCU choices out there.
None of the Asian companies you mentioned are direct competitors, unless you're talking about pure foundry business.
If a big war breaks out in Asia, we're talking WW3, as it would not be limited to Asia.


You forgot Nvidia, AMD, Broadcom, ON Semi, TI, Analog Devices, Microchip, Maxim, Cypress and a few others.
Cypress was sold to Infineon quite some time ago, that's in Germany. Maxim is part of analog devices, the others are American, you forgot lattice though (the last independent fpga company), as well as synopsys and cadence (mentor was sold to German Siemens).

Though, I agree, the US is the top country in semiconductors by far, at least when it comes to design. Manufacture is another story however.
 

TheLostSwede

News Editor
Joined
Nov 11, 2004
Messages
18,272 (2.46/day)
Location
Sweden
System Name Overlord Mk MLI
Processor AMD Ryzen 7 7800X3D
Motherboard Gigabyte X670E Aorus Master
Cooling Noctua NH-D15 SE with offsets
Memory 32GB Team T-Create Expert DDR5 6000 MHz @ CL30-34-34-68
Video Card(s) Gainward GeForce RTX 4080 Phantom GS
Storage 1TB Solidigm P44 Pro, 2 TB Corsair MP600 Pro, 2TB Kingston KC3000
Display(s) Acer XV272K LVbmiipruzx 4K@160Hz
Case Fractal Design Torrent Compact
Audio Device(s) Corsair Virtuoso SE
Power Supply be quiet! Pure Power 12 M 850 W
Mouse Logitech G502 Lightspeed
Keyboard Corsair K70 Max
Software Windows 10 Pro
Benchmark Scores https://valid.x86.fr/yfsd9w
Cypress was sold to Infineon quite some time ago, that's in Germany. Maxim is part of analog devices, the others are American, you forgot lattice though (the last independent fpga company), as well as synopsys and cadence (mentor was sold to German Siemens).

Though, I agree, the US is the top country in semiconductors by far, at least when it comes to design. Manufacture is another story however.
Forgot about Cypress. Maxim seems to be operating independently though.

On Semi has fabs, so does TI.
 
Joined
Feb 18, 2010
Messages
1,850 (0.34/day)
System Name Eldritch
Processor AMD Ryzen 5 5800X3D
Motherboard ASUS TUF X570 Pro Wifi
Cooling Satan's butthole after going to Taco Bell
Memory 64 GB G.Skill TridentZ
Video Card(s) Vega 56
Storage 6*8TB Western Digital Blues in RAID 6, 2*512 GB Samsung 960 Pros
Display(s) Acer CB281HK
Case Phanteks Enthoo Pro PH-ES614P_BK
Audio Device(s) ASUS Xonar DX
Power Supply EVGA Supernova 750 G2
Mouse Razer Viper 8K
Software Debian Bullseye
Does the GPP have support for DDR or is it just HBM2E?
 
Top