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NVIDIA "Hopper" Might Have Huge 1000 mm² Die, Monolithic Design

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1000mm is 100cm which is 1meter or around 40" for you Americans
Thanks for the tip.... except you would be incorrect. The measurement is 1000mm squared, which is equal to 100mm wide by 100mm long. It's a function of area not total length of any one side.

TADA! Math is fun!
 
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Thanks for the tip.... except you would be incorrect. The measurement is 1000mm squared, which is equal to 100mm wide by 100mm long. It's a function of area not total length of any one side.

TADA! Math is fun!

It's ~31.62mm.

TADA!
 
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It's ~31.62mm.

TADA!
Let's review...
and it appears that NVIDIA's performance targets have led to the creation of a monstrous, ~1000 mm² die package for the GH100 chip
... that's what the article stated....
1000mm is 100cm which is 1meter or around 40" for you Americans
... and this was stated(implying an insulting tone), to which I replied....
Thanks for the tip.... except you would be incorrect. The measurement is 1000mm squared, which is equal to 100mm wide by 100mm long. It's a function of area not total length of any one side.

TADA! Math is fun!
...with this.

So...
It's ~31.62mm.

TADA!
...where does YOUR comment come in? Hmmm? Your math skills seem about as good as mister oobymach.
 
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Let's review...

... that's what the article stated....

... and this was stated(implying an insulting tone), to which I replied....

...with this.

So...

...where does YOUR comment come in? Hmmm? Your math skills seem about as good as mister oobymach.

100mm wide and 100mm long does not get you a surface area of 1000mm2 but 10000mm2.
 
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Thanks for the tip.... except you would be incorrect. The measurement is 1000mm squared, which is equal to 100mm wide by 100mm long. It's a function of area not total length of any one side.

TADA! Math is fun!
What if it is a one-dimensional chip, 1000 mm long and rolled into a chromosome-like shape to be more practical? Data goes in at one end, exits at the other.

Actully neither of those is a necessity , they can print beyond reticle limit by making multriple passes it's just that yealds will be poor but this is HPC so money is not really an issue as long as perf is there .
I too saw the possibility of multiple exposures mentioned somewhere, do you happen to have any links?

Regarding the yield, I'm sure such a chip can operate with a small percentage of bad compute units, so it shouldn't be horribly low.
 
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TIE FIRST ROUND OF SALES TO STEAM ACCOUNTS WITH AT LEAST 1K+ GAMES AND 10 YEARS OLD IN LENGTH+

then lower the requirements for each round of graphics card sales after that.


THIS IS what nvidia/amd would do if they cared about gamers, yes i know not everyone plays on steam, but at this is is a starting point for the first say 7 rounds before you open it up to everyone.

but w.e

I thought Steam fans were against exclusive deals?!

;)
 
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TIE FIRST ROUND OF SALES TO STEAM ACCOUNTS WITH AT LEAST 1K+ GAMES AND 10 YEARS OLD IN LENGTH+

then lower the requirements for each round of graphics card sales after that.


THIS IS what nvidia/amd would do if they cared about gamers, yes i know not everyone plays on steam, but at this is is a starting point for the first say 7 rounds before you open it up to everyone.

but w.e
What a great idea....I wonder why noone else thought about it. Oh, nevermind, I know, cause it's dumb
 
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Actully neither of those is a necessity , they can print beyond reticle limit by making multriple passes it's just that yealds will be poor but this is HPC so money is not really an issue as long as perf is there .
Didn't know. Do you have any links?
Also, if you can print beyond the reticle limit, why is it called the reticle ""limit"" in the first place? Like what is the principle used to decide that this particular size is the reticle limit?
What if it is a one-dimensional chip, 1000 mm long and rolled into a chromosome-like shape to be more practical? Data goes in at one end, exits at the other.
What if we created such a chip but instead of using 0s and 1s we use As, Ts, Cs and Gs? Woudn't that be best for ML?
Regarding the yield, I'm sure such a chip can operate with a small percentage of bad compute units, so it shouldn't be horribly low.
Just like Ceberas' Wafer Scale Engine then?
 
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Also, if you can print beyond the reticle limit, why is it called the reticle ""limit"" in the first place? Like what is the principle used to decide that this particular size is the reticle limit?
The limit is 33 mm x 26 mm = 858 mm2 for DUV and apparently it's the same for EUV. The whole optical system of the scanner machine is designed for this size so there's no trivial way to make it bigger. Some kind of stitching and using multiple exposures is required for larger chips, I too would like to know more.
Just like Ceberas' Wafer Scale Engine then?
Big chips with a large number of equal units are always designed with some redundancy. Processors, RAM, NAND. Cerebras, I suppose, is more complex than all of those, its interconnect is similar to a network of network routers and it has the ability to route data around defective processors.
 
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100mm wide and 100mm long does not get you a surface area of 1000mm2 but 10000mm2.
Really? Are you sure? Damn, I's just gotta improve on my math skills... :rolleyes:

What if it is a one-dimensional chip, 1000 mm long and rolled into a chromosome-like shape to be more practical? Data goes in at one end, exits at the other.
But what if we wrap it around like a pretzel and then plug it into the you-know-what?
 
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Really? Are you sure? Damn, I's just gotta improve on my math skills... :rolleyes:

I don't quite understand what your trying here, but it's interesting you mention other peoples insulting tone while doing the same.
Nothing bad happens if you make a mistake from time to time.
 
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yikes...
firefox_yjKhBoei3b.png

With the 5nm wafers costing 25 ~30k $, just manufacturing the die would be 1200$. That means that to break even, they'd need to sell this thing for at least 3k. As others mentioned, this would most definitely be meant only for HPC clients and probably start at 7-8k.
 
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yikes...
View attachment 234626
With the 5nm wafers costing 25 ~30k $, just manufacturing the die would be 1200$. That means that to break even, they'd need to sell this thing for at least 3k. As others mentioned, this would most definitely be meant only for HPC clients and probably start at 7-8k.
One thing these calculations don't account for is the intelligently designed elements, Nvidia have lead the world on the design of fault tolerant circuits, what I mean by that is they're very easy to disable elements on that have a fault limiting function and as we have seen throughout the years can bin defective chips into lower performance SKU very effectively.
Few would in reality have defects that cannot be used in some way.
 
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Oh for god's sake, how bad are people at maths. If the chip is square then clearly the length of the side is sqrt(1000) = 31.62mm. It's not rocket science, it's primary school math. If the chip was 100mm on a side then the area would be 100000mm^2.

Make it even simpler, if you had a rectangular chip that was 40mm x 25mm, what is the area?
 
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1000mm is 100cm which is 1meter or around 40" for you Americans, that is a big honking gpu die. I think we took a leap backward here,

* imagines trying to fit that motherboard sized block along with a pcb and rams and such required to run it in a cpu case.


They actually designed that card pretty well lol.
 

bug

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Oh for god's sake, how bad are people at maths. If the chip is square then clearly the length of the side is sqrt(1000) = 31.62mm. It's not rocket science, it's primary school math. If the chip was 100mm on a side then the area would be 100000mm^2.

Make it even simpler, if you had a rectangular chip that was 40mm x 25mm, what is the area?
Kudos to you if you learned how extract the square root in primary school. Spot on, otherwise.
 
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Thanks for the tip.... except you would be incorrect. The measurement is 1000mm squared, which is equal to 100mm wide by 100mm long. It's a function of area not total length of any one side.

TADA! Math is fun!
It is 1cm x 10cm = 10cm2 = 1000mm2
 

bug

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Oh for god's sake, how bad are people at maths. If the chip is square then clearly the length of the side is sqrt(1000) = 31.62mm. It's not rocket science, it's primary school math. If the chip was 100mm on a side then the area would be 100000mm^2.

Make it even simpler, if you had a rectangular chip that was 40mm x 25mm, what is the area?

well 1 too many zeros, it would be 10 000 mm^2, not 100 000.
 

bug

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well 1 too many zeros, it would be 10 000 mm^2, not 100 000.
Anyone else remembers when MS-DOS introduced numerical separators to the dir command? In a stroke of genius, that feature was called "no more fingers on the screen".
 
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Unlikely, as they can't focus the UV light that wide. Unless this is on some older process.
 
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1000mm is 100cm which is 1meter or around 40" for you Americans, that is a big honking gpu die. I think we took a leap backward here,

* imagines trying to fit that motherboard sized block along with a pcb and rams and such required to run it in a cpu case.

Love the video. But is it 1000mm^2 not 1000mm, they are talking about area, not a single dimension.

1000mm^2 = 10cm^2 = 1.55inch^2, so around 1.24inch sides for the square.
 

ppn

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EUV can't make them bigger than 429 unless there is some new developpement
For circuit designers, this means an effective field of 16.5 mm by 26 mm for a new maximum die size of 429 mm². Say goodbye to the massive dies we got used to from Intel and Nvidia. 2019-asml-euv
Or they could have blocks with 4 dies uncut and interconnected on the wafer itself.
 
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Unlikely, as they can't focus the UV light that wide. Unless this is on some older process.
They can use some good old stitching (but maybe it's not old enough for patents to have expired ... Ian Dr. Cutress has his doubts). One of the issues is that an ASML scanner can process 170 wafers per hour but that number is certainly reduced if it's used to draw the patterns for half of each chip in each pass, not whole chip.

Here's how a reticle (photomask) looks like: TSMC

EUV can't make them bigger than 429 unless there is some new developpement
Ironically, 429 mm2 is THE new development, entering mass production in 2025 (if you believe it - I'd rather say 202y or 202z or 202α). That's high-numerical aperture EUV. The photomask size will remain the same. The optical system, however, will reduce the image to a surface area that's half smaller than it is now.

Thanks for the link! I sometimes read stuff at Semi Engineering but it's usually over my head.
Or they could have blocks with 4 dies uncut and interconnected on the wafer itself.
Yes, that's the kind of stitching I mentioned. Not four equal dies but two different halves that together make one die.
 
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