AMD Ryzen 7000 Series Processor Spotted Running on MSI MAG B650 Motherboard at 1.5 Volts

[eidairaman1]

1.5v is routine on my 5900.. not a big deal really. On my Strix -F voltage regulation is quite sloppy compared to my XE, and it routinely saw 1.525-1.535v.. still not a problem. I am pretty sure my old 3600XT was getting up to 1.55v.

I remember Athlon XPs running at 1.5

 

[jesdals]

I was wondering if we would se a x6xx chipset for socket AM4 but now we know that 6 series is AM5

 

[Shtb]

I certainly wouldn't be, my ADL can do 5ghz at only 1.25.

And now look at number of Amps consumed, and you get the power consumption by multiplying two values.
The power consumption is important to you, isn't it?
Or are you just a fan of low voltage, just because node, used in your Intel processor, can do that?

 

[freeagent]

I remember Athlon XPs running at 1.5

I remember running mine at 2.1v

 

[trsttte]

I guess the SMD's are moved outside of the lid in order to give them better cooling. Another reason could be to make more room under the lid for a third (fourth?) chiplet, or a larger IO with full graphics.
Does anyone know?
View attachment 243687

I think some designer was just having fun, they could have made the IHS square without the extra bits to the sides

 

[LabRat 891]

I think some designer was just having fun, they could have made the IHS square without the extra bits to the sides

To me, looks like this was AMD's preventative measure to 'bendgate'.
I think the SMDs are largely filter caps. Makes sense to have them that spread out on the package when you've got such a pin-dense socket. We're also well into switching frequencies for busses and chips, that can illicit 'spooky' effects when not mitigated for. Not impossible the layout is in part for electrical 'noise'.

 

[SL2]

It's definitely have that shape to avoid getting bent.

My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.

Compare with AM4, where the glued part takes up more space.

The AM5 design basically have more area available which is equal to all the cutouts together, more or less.

The goal was to minimize the glued area, which is unusable for both SMD's and chips.

 

[Deleted member 24505]

Delidding should be easier too

And now look at number of Amps consumed, and you get the power consumption by multiplying two values.
The power consumption is important to you, isn't it?
Or are you just a fan of low voltage, just because node, used in your Intel processor, can do that?

Whatever

 

[mechtech]

All you need is some compressed air...

A pressure washer would work way better

 

[ir_cow]

Delidding should be easier too

I laughed so hard at this!

 

[TheDeeGee]

1.5v, nice. More power = more heat!

 

[Mussels]

Why is everyone assuming this is a stock voltage?

It could be an ES, an ES mobo, or someone doing overclocking/endurance testing?

 

[Deleted member 24505]

I laughed so hard at this!

oookay

 

[harm9963]

My 5950X for st 1.5v easy .

 

[ir_cow]

Why is everyone assuming this is a stock voltage?

It could be an ES, an ES mobo, or someone doing overclocking/endurance testing?

Because stock voltage of Zen2 and Zen3 is 1.5v for the turbo. Same 7nm node so I assume the voltages stay the same.

 

[thesmokingman]

1.5v, nice. More power = more heat!

It's not a real voltage though. Just stating it at 1.5v tells more about the speaker than the chip, oh the irony.

 

[eidairaman1]

It's definitely have that shape to avoid getting bent.

My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.
View attachment 243720

Compare with AM4, where the glued part takes up more space.
View attachment 243721
The AM5 design basically have more area available which is equal to all the cutouts together, more or less.

The goal was to minimize the glued area, which is unusable for both SMD's and chips.

Also this is AMDs first MSDT LGA, so where else would SMDs go?

 

[Max(IT)]

That's already expected from previous leaks. Everything points at new power tiers including 170W for at least the top end (7950x?)

AMD Zen 4 Desktop Processors Likely Limited to 16 Cores, 170 W TDP

We have recently seen several reputable rumors confirming that AMD's Zen 4 Raphael desktop processors will be limited to 16 cores with 2 compute units. There were previous rumors of a 24 core model with 3 compute units however that now seems unlikely. While the core counts won't increase some...

www.techpowerup.com

AMD Socket AM5 to Retain Cooler Compatibility with AM4?

AMD's upcoming desktop processor Socket AM5 could retain cooler compatibility with the outgoing Socket AM4, according to a leaked technical document related to the socket. If true, this would be the first time that two fundamentally different sockets—one a PGA, and the other an LGA—are designed...

www.techpowerup.com

AMD Ryzen 7000 Series "Raphael" Processors to Come with up to 170 Watt TDP for 16-Core SKUs

AMD is slowly preparing to transition its consumer base into a new platform and processor architecture with the launch of Ryzen 7000 series processors codenamed Raphael. Based on the new AM5 LGA socket, these processors will come with up to 16 cores and 32 threads at the top-end configurations...

www.techpowerup.com

the 170W "TDP" is quite scaring, considering AMD's definition of TDP. My 5900W with 105W TDP can draw something like 165W in real usage (rendering). That means Zen 4 will stay well above 200W.

 

[HD64G]

the 170W "TDP" is quite scaring, considering AMD's definition of TDP. My 5900W with 105W TDP can draw something like 165W in real usage (rendering). That means Zen 4 will stay well above 200W.

As we saw with 5800X3D, 105W TDP =~110W power draw, so...

 

[SL2]

Also this is AMDs first MSDT LGA, so where else would SMDs go?

Under the lid? Not sure what you're hinting at. (I know there's no room under the package on AM5.)

the 170W "TDP" is quite scaring, considering AMD's definition of TDP. My 5900W with 105W TDP can draw something like 165W in real usage (rendering). That means Zen 4 will stay well above 200W.

We don't know it they're trying to be more realistic with TDP with that 170 W, or if they're going to be just as off as before (like you suggest). I bet it's the latter, tho.

 

[eidairaman1]

Under the lid? Not sure what you're hinting at. (I know there's no room under the package on AM5.)


We don't know it they're trying to be more realistic with TDP with that 170 W, or if they're going to be just as off as before (like you suggest). I bet it's the latter, tho.

Its the layout of those SMDs that keeps the lid open like that.

 

[Tek-Check]

It's definitely have that shape to avoid getting bent.

My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.
View attachment 243720

Compare with AM4, where the glued part takes up more space.
View attachment 243721
The AM5 design basically have more area available which is equal to all the cutouts together, more or less.

The goal was to minimize the glued area, which is unusable for both SMD's and chips.

Plus, cut outs provide more surface for heat dissipation. I am sure some cooler companies will soon design innovative contact plates that penetrate into those cut outs to increase heat absorption through more contact surface.

 

[Ruru]

I remember Athlon XPs running at 1.5

When we go back to that era, even 2V isn't that strange when overclocking S462 chips.

 

[chrcoluk]

Ryzen has always gone over 1.5v for CPB, one of the reasons I disable CPB on my Ryzen rig.

 

[Ruru]

Ryzen has always gone over 1.5v for CPB, one of the reasons I disable CPB on my Ryzen rig.

My 3600 seems to hit 1.416V max, I have PBO +200 clocks and -0.05V offset.