AMD's Upcoming Zen 4 CPU Delidded by Overclocker

[DeathtoGnomes]

What I don't get is how overclockers manage to get their hands on these CPUs so soon.

Dinner and a movie.

I think it's simply a matter of the LGA mounting system not being able to be made flat enough and make the IHS protrude the retention plate. So they compensate it by making a thick IHS.

I dont think a thicker IHS will matter if see board flex like whats happening with some Intel boards.

 

[Durvelle27]

I'm so curious about cooling on these now and how effective it will be

 

[TheDeeGee]

Such thick IHS possibly mitigates bending issues, which have always existed to some extent on Intel anyway (just got worse with Alder Lake).

Instead it will bend the motherboard

 

[Deleted member 24505]

Risky being a beta tester for these though. After all the jibes at intels ADL wonder how many hypocrites will buy these now.

 

[marios15]

Instead it will bend the motherboard

MotherboardBender is a good nickname for tech forums

 

[Deleted member 24505]

MotherboardBender is a good nickname for tech forums

Or just bender

 

[zlobby]

man that is one chunky lookin ihs

My thoughts exactly!

Risky being a beta tester for these though. After all the jibes at intels ADL wonder how many hypocrites will buy these now.

Have these been proven to bend mobos? Because I call FUD the things you say.

 

[TheoneandonlyMrK]

Risky being a beta tester for these though. After all the jibes at intels ADL wonder how many hypocrites will buy these now.

The jibes were earned by bendy socket's.

It's not yet the case that AMD'S new socket has been proven to have that issue.

So how then could anyone be a hypocrite?!.

Do you read what you post because dammmnnnnnn time and again it's some defamatory bullshit that shows a clear bias that also instigates a us v them war of words you then later moan about.

 

[freeagent]

230w PPT, thick ihs, smaller process.. these are gonna be hot. I already know how hard it is to cool 230w PPT.

 

[Jism]

Looks like LM disaster when it spills underneat, so many gaps ^^

There's no need to go "Direct die" cooling on Zen CPU's. Most of them are soldered and they do quite a good job in terms of heat transfer. The max we've seen is barely 4 degrees cooler once you remove the IHS.

Not sure if thats worth breaking your warranty.

230w PPT, thick ihs, smaller process.. these are gonna be hot. I already know how hard it is to cool 230w PPT.

The 230W PPT is only at higher end models.

 

[DeathtoGnomes]

Or just bender

Intel will claim copycat rights on that bender.

 

[mechtech]

2 chips on the edge. Gonna have to make sure cooler and thermal paste get right to the edge or a bit further

 

[Deleted member 24505]

The jibes were earned by bendy socket's.

It's not yet the case that AMD'S new socket has been proven to have that issue.

So how then could anyone be a hypocrite?!.

Do you read what you post because dammmnnnnnn time and again it's some defamatory bullshit that shows a clear bias that also instigates a us v them war of words you then later moan about.

The beta test jibes were not just about the socket at all. Just the usual TPU anti Intel bullshit.

And you are the ONLY one saying time and again it's some defamatory bullshit strange eh I think you just like to find any excuse to shit stir with me when you could just ignore me and not cause trouble. Do i do the same to you even if you annoy the fuck out of me? no i just leave you alone. Maybe you should try doing the same.

 

[TheoneandonlyMrK]

My thoughts exactly!


Have these been proven to bend mobos? Because I call FUD the things you say.

I agree Zlobby.

 

[Deleted member 24505]

I read loads of comments saying it's bad to buy first gen of new board/CPU as was the case with ADL, but I guess it's different when it's AMD eh. So many double standards on TPU now.

Maybe I should just switch to AMD and join in the Intel flaming posts, can't be called biased then can I.

My thoughts exactly!


Have these been proven to bend mobos? Because I call FUD the things you say.

Does this face look bovvered. You full of FUD Mr pot

 

[TheoneandonlyMrK]

I read loads of comments saying it's bad to buy first gen of new board/CPU as was the case with ADL, but I guess it's different when it's AMD eh. So many double standards on TPU now.

Maybe I should just switch to AMD and join in the Intel flaming posts, can't be called biased then can I.



Does this face look bovvered. You full of FUD Mr pot

Plus
"

The beta test jibes were not just about the socket at all. Just the usual TPU anti Intel bullshit."

No one was bashing Intel, your precious was kept out the convo in this AMD based thread.

And I agree, don't buy generation one, ever .

Maybe you should chill out, and work on your banter, if that's what you intended.

And stop taking everything so personally.

 

[InVasMani]

It's probably thicker due to be soldered so while it will absorb plenty of heat it can transfer it more effectively to another source at the same time. That only helps if the other source can then dissipate the heat effectively enough, but that's expected given it'll either be bundled with a appropriate cooler or TDP ratings will dictate what type of minimum level of cooling to pair with it. I really doubt it's that thick simply due to bending concerns.

Given the overall thickness is it possible that it's a vapor chamber designed IHS soldered to the die between itself and cooling options mounted to it!!?

 

[spnidel]

wtf... there's a CPU under the IHS?!

 

[Blaeza]

wtf... there's a CPU under the IHS?!

Even I knew that bit...

 

[Deleted member 24505]

Plus
"

The beta test jibes were not just about the socket at all. Just the usual TPU anti Intel bullshit."

No one was bashing Intel, your precious was kept out the convo in this AMD based thread.

And I agree, don't buy generation one, ever .

Maybe you should chill out, and work on your banter, if that's what you intended.

And stop taking everything so personally.

I take things personally when it is aimed at me, which your replys to my comments quite often are.

And it's not my precious, it's just a CPU. AMD users on here are far more touchy about their precious than me.


Let's just see how zen4 and AM5 pan out. Intel has been using these socket types for a long let's see how AM5 goes for AMD.

Not a great fan of the IHS design but hopefully it'll be ok.

 

[spnidel]

Even I knew that bit...

no way... I had no clue...

 

[Blaeza]

no way... I had no clue...

Could of been a marshmellow!

 

[InVasMani]

Just stick to a thermal grizzly pad on the IHS or don't fret over the the paste is gonna suck to clean part which paste in my experience has always been a hassle to clean anyway. If Zen 4 one architecture to rule them all "my precious 16c" Lisa Su's sweet 16 edition... I certainly hope it's good for the meme's alone.

 

[zlobby]

It's probably thicker due to be soldered so while it will absorb plenty of heat it can transfer it more effectively to another source at the same time. That only helps if the other source can then dissipate the heat effectively enough, but that's expected given it'll either be bundled with a appropriate cooler or TDP ratings will dictate what type of minimum level of cooling to pair with it. I really doubt it's that thick simply due to bending concerns.

Given the overall thickness is it possible that it's a vapor chamber designed IHS soldered to the die between itself and cooling options mounted to it!!?

I wonder why they don't make IHS's with built-in water blocks? You know, just hook up the hoses and let it rip!

I for one will gladly pay for such option. With power reaching 250W every degree helps. I'd estimate at least 5-6C lower temps with such solution, which should do miracles here.

 

[LabRat 891]

With an IHS that thick, and non-centered Chiplets, I'm wondering if a composite IHS would be 'in the cards'. Either 2 copper sheets sandwiching a sheet of pyrolytic graphite, or 2 copper sheets CVD'd with Graphene and pressed together. Copper conducts heat well, but evenly. 2D and semi-2D carbon allotropes conduct heat across their planar axis considerably better than copper or silver does.

Unlike a decade or 2 ago, (when tech enthusiasts first started 'playing with' allotropic carbons' thermal properties) pyrolytic graphite and/or graphene are common materials nowadays in microelectronics cooling.

Separate thought: Is there any technical reason preventing the end-user from sealing the IHS to the CPU-package's PCB with black Silicone II or nail polish? (Can heated air trapped under the IHS 'dislodge' or damage anything, if not allowed free exchange with atmosphere?)