Do we know with any certainty which companies actually make NAND packages (buy wafers and do the dicing, binning, thinning, packaging, testing, marking, in at least six facilities on at least three continents) and which ones just rebrand those packages (erasing, marking, two continents)?
One example: as W1zzard states in his
review of the HP FX900, "The two flash chips are Micron 176-layer 3D TLC NAND. They have been rebranded by BIWIN, who's manufacturing this drive for HP. BIWIN buys the wafer from Micron, cuts and test the individual dies, and then packages them into their own chips." Meanwhile, in the database it's "Rebranded: BW29F4T08ENLEE".
There may be many cases like this, and it's not fair to call them rebrands.