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| Processor | Intel Core 2 Quad Q6600 G0 VID: 1.2125 |
|---|---|
| Motherboard | GIGABYTE GA-P35-DS3P rev.2.0 |
| Cooling | Thermalright Ultra-120 eXtreme + Noctua NF-S12 Fan |
| Memory | 4x1 GB PQI DDR2 PC2-6400 |
| Video Card(s) | Colorful iGame Radeon HD 4890 1 GB GDDR5 |
| Storage | 2x 500 GB Seagate Barracuda 7200.11 32 MB RAID0 |
| Display(s) | BenQ G2400W 24-inch WideScreen LCD |
| Case | Cooler Master COSMOS RC-1000 (sold), Cooler Master HAF-932 (delivered) |
| Audio Device(s) | Creative X-Fi XtremeMusic + Logitech Z-5500 Digital THX |
| Power Supply | Chieftec CFT-1000G-DF 1kW |
| Software | Laptop: Lenovo 3000 N200 C2DT2310/3GB/120GB/GF7300/15.4"/Razer |
During his keynote presentation at the start of IDF Taiwan (October 15-16) Mooly Eden, vice president of mobile platforms group, Intel, demonstrated a working quad-core CPU design which will eventually target notebook platforms. Intel is still in the early stages of development. Intel claimes the chip contains 840 million transistors and will run at a power envelope of 45W, slightly higher than Intel's mainstream TDP of 35W, meaning that the extra performance is going to come at an understandable hit in battery life. Intel said it is on track to launch the CPU in the second half of 2008. Also during the keynote address, Eden presented a new strategy for cooling notebooks based on compressor technology similar to that used in refrigerators and air conditioners. The compressor on display was a cylinder about 2cm in diameter and 10cm long and Eden showcased a notebook stand and cooling system containing three compressors which he claimed can reduce notebook chassis temperatures by around 10-degrees Celsius. Eden also showed how the compressors can be incorporated directly with a notebook's heatsink and fan assembly to be installed internally in the system. Finally, Eden also revealed a material Intel is developing that is permeable to air but acts as a barrier for liquids. Using the material, notebook makers will be able to design notebooks that take air for cooling through the keyboard rather than from vents on the underside or rear, commonly used in the notebooks today.
View at TechPowerUp Main Site
View at TechPowerUp Main Site
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