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Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.
MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.
The tipster anticipates that the Dimensity 9300 will offer a substantial performance leap over its older sibling in terms of raw performance, but it is too early to say how it will fare when pitched against the Snapdragon 8 Gen 3. The in-progress MediaTek SoC is said to feature an ultra-large core + big core + small core layout - with Arm's Cortex-X4 CPU core expected to sit in the largest seat, followed by a Cortex A715 in second place, and the smaller occupants being A515-based. Vivo is likely preparing a next-gen flagship smartphone, dubbed "Vivo X100", and this highly appointed model is rumored to be rigged up with MediaTek's soon-to-be finest chipset.
View at TechPowerUp Main Site | Source
MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.
The tipster anticipates that the Dimensity 9300 will offer a substantial performance leap over its older sibling in terms of raw performance, but it is too early to say how it will fare when pitched against the Snapdragon 8 Gen 3. The in-progress MediaTek SoC is said to feature an ultra-large core + big core + small core layout - with Arm's Cortex-X4 CPU core expected to sit in the largest seat, followed by a Cortex A715 in second place, and the smaller occupants being A515-based. Vivo is likely preparing a next-gen flagship smartphone, dubbed "Vivo X100", and this highly appointed model is rumored to be rigged up with MediaTek's soon-to-be finest chipset.
View at TechPowerUp Main Site | Source
