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Samsung Claims 60-70% Yields for its 3 nm Node

btarunr

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Samsung Electronics is engaged in stiff competition with TSMC for chip manufacturing orders for 3 nm, its first semiconductor foundry node to implement GAA-FET technology, after nearly a decade of FinFET-based nodes. SF3, a 3 nm GAA-FET node, enters mass-production later this year. Samsung is claiming wafer yields in the range of 60-70% in the development phases of the node. This number is crucial to attract customers as they base their wafer orders squarely on yields first, and cost-per-wafer next.

Samsung is trying to rebuild confidence among chip designers after the 2022 controversy over its engineering "fabricating" yield numbers to customers to win their business. Samsung also stated that with 2023-2024 being dominated by 3 nm-class nodes, namely SF3 (3GAP), and its refinement the SF3P (3GAP+), the company will begin introducing its 2 nm class nodes in 2025-2026. Samsung's current customers for its 3 nm node include unnamed HPC processor designer, and a mobile AP (application processor) designer.



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Is 60-70% yield normal in the Development Phase of a node?
 

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Is 60-70% yield normal in the Development Phase of a node?
That's often at the point where they start production as far as I'm aware, with the expectation to improve from there. However, the issue is when things don't improve from there, then it gets very expensive for the foundry. TSMC was reported somewhere between 60 and 80%, which is a bit better, but also not as clear as to where in the span they might've been.
On top of that, it matters what type of chip it is, as smaller chips tend to have better yield rates than larger chips, since the defects are spread out across the entire silicon wafer. If you're lucky, the defects end up causing minimum issues, if you're unlucky, most of a wafer is unusable.
 
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Semi-related, I'm also wondering if the last-level cache of today's processors is designed with manufacturing defects in mind, so it can operate when there's a small number of defects on it.
 
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Semi-related, I'm also wondering if the last-level cache of today's processors is designed with manufacturing defects in mind, so it can operate when there's a small number of defects on it.
Caches are typically defect resistant due to some redundancy. The yield of a Ryzen chiplet is even higher than the naive calculation would indicate.
 
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Caches are typically defect resistant due to some redundancy. The yield of a Ryzen chiplet is even higher than the naive calculation would indicate.
Do you have any sources for that? That is my assumption too, but I don't think there's redundancy in the form of additional cache lines (like Zen having 32.01 MiB total and 32 usable). Rather, the defective cache lines are just tagged as such and not used, which doesn't affect the operation of the rest of them (so there's 32 MiB total and 31.99 usable).
 
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Do you have any sources for that? That is my assumption too, but I don't think there's redundancy in the form of additional cache lines (like Zen having 32.01 MiB total and 32 usable). Rather, the defective cache lines are just tagged as such and not used, which doesn't affect the operation of the rest of them (so there's 32 MiB total and 31.99 usable).
Sadly, my sources are for older processors and don't pertain to any that are current. Of course, given the high yield of these very small chiplets, at least AMD might have opted to forgo redundancy for the small savings in area.
 
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Is Samsung making anything interesting at the moment?
I know the do nand and ram anything other than their own exynos?
 
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So it's basically at most 40%. Which is on pair with Intel, or TSMC....
 
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