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TSMC is quickly reacting to a surge in demand for NVIDIA hardware following an AI industry boom - the Taiwanese semiconductor contract manufacturer is reportedly planning to further expand its advanced packaging capabilities, due to current production lines hitting maximum capacity. News outlets have also cited the growth of 5G technology and Internet of Things (IoT) device markets as contributing factors. DigiTimes Asia reports that clients are snapping up chip-on-wafer-on-substrate (CoWoS) at an increased and unprecedented rate. TSMC has decided to provide NVIDIA - an extremely high profile customer - with an extra 10,000 CoWoS wafers. The article sourced information from a recent company shareholder meeting, where chairman Mark Liu discussed these expansions plans. He outlined improved factory facilities that will result in an additional output of 1,000 to 2,000 wafers per month. TSMC is set to upgrade equipment at its existing facilities in order to meet increasing demand.
Trendforce has also published its evaluation from the same TSMC shareholding meeting: "Due to the generative AI trend initiated by ChatGPT, the demand for advanced packaging orders for TSMC has increased, forcing an increase in advanced packaging capacity. TSMC also pointed out that the demand for TSMC's advanced packaging capacity far exceeds the existing capacity, and it is forced to increase production as quickly as possible. Chairman Mark Liu stated that the current investment in R&D focuses on two legs, namely 3D IC (chip stacking) and advanced packaging...At present, three-quarters of TSMC's R&D expenditure is used for advanced processes, and one quarter for mature and special processes, with advanced packaging falling under mature and special processes."
View at TechPowerUp Main Site | Source
Trendforce has also published its evaluation from the same TSMC shareholding meeting: "Due to the generative AI trend initiated by ChatGPT, the demand for advanced packaging orders for TSMC has increased, forcing an increase in advanced packaging capacity. TSMC also pointed out that the demand for TSMC's advanced packaging capacity far exceeds the existing capacity, and it is forced to increase production as quickly as possible. Chairman Mark Liu stated that the current investment in R&D focuses on two legs, namely 3D IC (chip stacking) and advanced packaging...At present, three-quarters of TSMC's R&D expenditure is used for advanced processes, and one quarter for mature and special processes, with advanced packaging falling under mature and special processes."
View at TechPowerUp Main Site | Source