Pat Gelsinger Says 3D Stacked Cache Tech Coming to Intel

[AusWolf]

Moving the cores on top of the cache instead of the other way around should improve thermals.

The question that remains is the price.

 

[Vayra86]

U.S. patent application number 17/129739 was filed with the patent office on 2021-12-02 for stacked dies for machine learning accelerator. This patent application is currently assigned to Advanced Micro Devices, Inc.. The applicant listed for this patent is Advanced Micro Devices, Inc.. So its clearly owned by AMD just manufacturing side being done by TSMC.

https://uspto.report/patent/app/20210374607

Also one of the person on that patent is my classmate and currently he seems to be employed by Intel.

There are older(now expired) patents from T.I. and Philips as well:

US6141235A - Stacked cache memory system and method - Google Patents

A stacked cache memory system and method is provided. The stacked cache memory system (10) may include a memory cell array (22) coupled to a cache system (30). The memory cell array (22) stores and retrieves a data signal. Recently retrieved data signals are stored in a number of sense-amp...

patents.google.com

US5953741A - Stack cache for stack-based processor and method thereof - Google Patents

A multiple processor circuit arrangement utilizes a master processor which controls the operational state of a slave processor by programming internal control registers on the slave processor. In addition, a stack-based processor utilizes a stack cache for accelerating stack access operations...

patents.google.com

Post 6 is factual, everything before it is just misinformed trash...

Nice.

Through-silicon via - Wikipedia

en.wikipedia.org

No, it was around long before. AMD did work with interposers that readied the stacked cache/memory for commercial manufacturing with TSMC. https://www.amd.com/en/technologies/hbm

That and in this industry moving forward generally does mean working together to create something new. Each company adds its speciality. TSMC is not in the business of making chips. They provide the tooling to make the chips.

 

[PapaTaipei]

I didn't know this, cool, surprised its not going to be a part of Meteor Lake, the writing was on the wall Intel...



cause of money, this is why Apple and Nvidia are walled gardens so no one can use their inventions. As much as I love AMD, FSR3 Frame Gen is never going to match the dedicated tensor core DLSS 3.5 and DLSS4 frame gen in sheer quality, just no way no how. That's how you make bank.

TSMC is I hope making money off its 3dcache invention, if not, then they are a foolish company.

Fake frames enjoyer but I believe you are right.

 

[Tomorrow]

You make it sounds like everything AMD did was trivial.
If it is so simple then Intel would have achieve this long ago, not wait for a couple gen and let AMD "steal" their thunder.
Intel is making a big deal out of this, I would assume there are some major engineering hurdle that they overcame.

Yeah there is a subset of Intel fanboys perpetuating the myth that AMD could have not accomplished anything without TSMC.
I need to remind people then that Zen 1 and Zen+ were manufactured on GloFo's 12nm process and were still disruptive despite the node disadvantage.

 

[PapaTaipei]

Useless comment but I love the editor picking a pic of Pat with this hand gesture he reminds me of the "ancient aliens" meme.

 

[ixi]

Cool, intel wants to get back gaming crown

 

[sethmatrix7]

Bbbbut MUH E-Cores!!!