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System Name | stress-less |
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Processor | 9800X3D @ 5.42GHZ |
Motherboard | MSI PRO B650M-A Wifi |
Cooling | Thermalright Phantom Spirit EVO |
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Keyboard | 65% HE Keyboard |
Software | Windows 11 |
Benchmark Scores | They're pretty good, nothing crazy. |
So the reason they use a huge amount of power is if they're trying to cool something the pelt isn't really kitted to handle (like a 300W processor). -- if you use it say on a larger area on the side of the rad -- or somewhere else in the loop -- like separate area/block in the loop that's hooked up to a heatpipe cooler etc. -- essentially giving you another 100W or so of chiller effect when needed, and more surface area for cooling, and the ability to chill water on demand to keep it just above the dew point.They could have done something interesting with a very miniaturized heat pump but instead went with the stupid peltier that simply can't work, it's a pitty. I don't really understand who green lit an ongoing R&D project on this kind of tech, this is the kind of thing that a bunch of nerds in the office do in the off time, not something to waste office hours on.
The only place where it makes sense to drop the peltier is between the chip and block. The peltier doesn't really "cool" something, what it does is use a HUGE ammount of power to move heat from one side to the other. It makes sense to use it between a chip and block because you can take the heat away from the chip at a much higher capacity than the block would be able to alone.
The problem with trying to cool a 300W cpu with a pelt is it will use a monsterous amount of power, and it will still suffer from the "shim" effect (where the transfer of double thermal paste makes it even less effective). As it gets saturated it does the pelt thing where it becomes basically useless.
Actually the CPUs that would benefit the most from a 125W pelt on the chip is a 7800X3D -- something that doesn't generate more than 90W of heat load but LOVES getting a colder contact plate.
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