JEDEC Publishes New CAMM2 Memory Module Standard

[TheLostSwede]

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s) in a single, comprehensive document. JESD318 CAMM2 is available for download from the JEDEC website.

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.




While JESD318 CAMM2 defines a common connector design for both DDR5 and LPDDR5/X, it is crucial to note that the pinouts for each differ. To support different motherboard designs, intentional variations in mounting procedures between DDR5 and LPDDR5/X CAMM2s prevent the mounting of a module where it should not go.

As announced earlier this year, JESD318 CAMM2 supports stackable CAMM2s: dual-channel (DC) and single-channel (SC). By splitting the dual-channel CAMM2 connector lengthwise into two single-channel CAMM2 connectors, each connector half can elevate the CAMM2 to a different level. The first connector half supports one DDR5 memory channel at 2.85 mm height while the second half supports a different DDR5 memory channel at 7.5 mm height. Or, the entire CAMM2 connector can be used with a dual-channel CAMM2. This scalability from single-channel and dual-channel configurations to future multi-channel setups promises a significant boost in memory capacity.

"The development of JEDEC CAMM2 exemplifies JEDEC's commitment to serving the industry with innovative standards. CAMM2 is versatile across various use cases and is designed with future scalability in mind," said Mian Quddus, JEDEC's Board of Directors Chairman.

Tom Schnell, JEDEC's CAMM Task Group Chairman, added: "JEDEC CAMM2 is positioned to support and drive next-generation products, offering designers an extensive range of modularity options. As technology evolves, memory requirements grow, and JEDEC CAMM2 is at the forefront of addressing these demands. The support for future multi-channel configurations ensures that designers and manufacturers are not just meeting current needs but are also well-prepared for the evolving landscape of memory solutions."

View at TechPowerUp Main Site | Source

 

[MaMoo]

This can go up to 256 GB apparently. It would pair well with 16 p-cores or Ryzen cores for serious mobile workstation performance.

 

[Chaitanya]

But will this be adopted? Never saw CAMM adoption apart from handful of modules for sale from Dell.

 

[unwind-protect]

Good tech.

Hopefully there will be more laptops with exchangeable RAM modules based on this.

 

[TheLostSwede]

But will this be adopted? Never saw CAMM adoption apart from handful of modules for sale from Dell.

Now that it's a JEDEC spec, it's likely it will be adopted.

 

[BrainCruser]

But will this be adopted? Never saw CAMM adoption apart from handful of modules for sale from Dell.

The JEDEC spec is actually a prerequisite to getting adoption. With this spec, CAMM is well on its way to replacing SODIMMs.

 

[Squared]

Where does LPCAMM fit in? Was it like an early draft and CANM2 replaces it?

Samsung Electronics' Industry-First LPCAMM Ushers in Future of Memory Modules

Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops - and potentially even data centers...

www.techpowerup.com

 

[_JP_]

If next gen consoles and handhelds adopt this standard, less waste is created every 7~9 years with the generation of consoles.
So we could upgrade RAM, besides storage, giving added capacity in a closed environment, devs could at least play with graphic fidelity without having a hassle regarding system support based on resource detection.

 

[Slizzo]

Consoles aren't likely to have this figured in. They want fixed hardware to have the developers able to work for one platform. Or in MS's case, two.

 

[Wirko]

How thick is the entire CAMM structure going to be, with the appropriate retaining brackets/pressure plates in place? There must be some strong mechanism that holds the spring contacts and the LGA (land grid array) firmly together to ensure good contact in the presence of vibration and dirt, as some people noted in the thread about the Framework laptop.

 

[Denver]

They should be looking for a way to put an end to single-channel setups and establish dual-channel as the standard for low-end/basic laptops, with quad-channel becoming the next level for high-performance machines.

 

[TheLostSwede]

Where does LPCAMM fit in? Was it like an early draft and CANM2 replaces it?

Samsung Electronics' Industry-First LPCAMM Ushers in Future of Memory Modules

Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops - and potentially even data centers...

www.techpowerup.com

It seems to have been a solution for LPDDR type memory, which the original CAMM from Dell didn't take into consideration, but the CAMM2 spec mentions all types of DDR5, including LPDDR with or without an X at the end, so it would seem CAMM2 replaces everything announced prior to it.

If next gen consoles and handhelds adopt this standard, less waste is created every 7~9 years with the generation of consoles.
So we could upgrade RAM, besides storage, giving added capacity in a closed environment, devs could at least play with graphic fidelity without having a hassle regarding system support based on resource detection.

This is not for GDDR type memory though.

They should be looking for a way to put an end to single-channel setups and establish dual-channel as the standard for low-end/basic laptops, with quad-channel becoming the next level for high-performance machines.

CAMM2 modules are dual channel by default, so I guess that solves your problem. Although it seems like there's some option to make single channel CAMM2 modules too according to the press release.

How thick is the entire CAMM structure going to be, with the appropriate retaining brackets/pressure plates in place? There must be some strong mechanism that holds the spring contacts and the LGA (land grid array) firmly together to ensure good contact in the presence of vibration and dirt, as some people noted in the thread about the Framework laptop.

Not sure if there are any publicly released measurements.
This is from the older Dell spec.

 

[trsttte]

Where does LPCAMM fit in? Was it like an early draft and CANM2 replaces it?

Samsung Electronics' Industry-First LPCAMM Ushers in Future of Memory Modules

Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops - and potentially even data centers...

www.techpowerup.com

There's no mention of JEDEC on that press release and they are yet to bring it to market so most likely it fits directly into a garbage disposable. Sucks for whoever was working on it but we don't need a samsung specific format and hopefully they're not dumb enough to attempt it.

This is not for GDDR type memory though.

Some (if not most) handhelds are using LPDDR. I think the more likely problem is the exotic way in which memory has to be placed. Consoles on the other hand will just want to keep the platform fixed because fuck you, buy the Pro version instead.

CAMM2 modules are dual channel by default, so I guess that solves your problem. Although it seems like there's some option to make single channel CAMM2 modules too according to the press release.

That's not great... Too many module variants will limit adoption and compatibility. The original CAMM demonstrated by Dell was awfull with a different sized module for almost every different ram capacity

 

[Chaitanya]

Now that it's a JEDEC spec, it's likely it will be adopted.

Dell did get Jedec to approve older CAMM as a standard but still there was little to no adoption. But hopefully given promise of capapcity and speed this time around things will be different.

 

[LabRat 891]

Not a fan of the LGA-style interconnect but, I *now* see its necessity.

After some reading-around, I support this new standard.
Without it, we'll have lost user-upgradeable RAM entirely (v. soon).

 

[trsttte]

Dell did get Jedec to approve older CAMM as a standard but still there was little to no adoption. But hopefully given promise of capapcity and speed this time around things will be different.

There wasn't much time for it to take off, it was only accepted by jedec in january when the new crop of laptops with the latest generation of cpus was well underway and is only now being published as a standard. Let's see how it goes from here on out

 

[KLMR]

As you can read in chapter 3.2.1 of JESD318 Ver. 1.02 document of the standard it includes new excuses for marketing deparments for soldered RAM on laptops. Good standard indeed!

 

[Pizdarenkowitch]

Good tech.

Hopefully there will be more laptops with exchangeable RAM modules based on this.

But never a Mac Book "pro"

 

[TheLostSwede]

As you can read in chapter 3.2.1 of JESD318 Ver. 1.02 document of the standard it includes new excuses for marketing deparments for soldered RAM on laptops. Good standard indeed!

Care to share that, since it requires JEDEC membership to read.

 

[Mawkzin]

There's no mention of JEDEC on that press release and they are yet to bring it to market so most likely it fits directly into a garbage disposable. Sucks for whoever was working on it but we don't need a samsung specific format and hopefully they're not dumb enough to attempt it.

"Schnell indicates that voting has already taken place to proceed with a draft version of the specifications. “We have unanimous approval of the 0.5 spec,” he is reported as saying, with JEDEC aiming to have the 1.0 specifications finalized in the second half of 2023 and production systems based on it out by next year." Quote from "theregister. com/2023/01/17/jedec_to_formalize_dell_laptop/"

They're already working with the 0.5 spec, sk hynix and samsung are releasing the same type of lpddr format hoping to be the first in line when camm kicks out.

 

[Wirko]

Will there be unbuffered non-ECC, unbuffered ECC, buffered non-ECC, buffered ECC, fully buffered, load reduced, low voltage, low profile (=thinner), very low profile and other flavours of CAMM2 standard modules to choose from? DDR5LFBSDRAMECCVLPCAMM2 is probably the one I'll be looking for when it arrives.

 

[KLMR]

Care to share that, since it requires JEDEC membership to read.

I thought it was ovbious that no JEDEC, IEC, NEMA, ASMe, etc. standards include a chapter for marketing excuses NOT YET.