Intel Lunar Lake-MX to Embed Samsung LPDDR5X Memory on SoC Package

[AleksandarK]

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.



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[dgianstefani]

Maybe we'll finally get laptops without atrocious memory latency.

 

[Ferrum Master]

Apple's use of on-package memory in its M-series chips has set a precedent in the industry

Well sure... not... It ain't something new in mobile space... the heck 99% phones use stacked designs with combo memory since ages... why bother altering the reality with such statement? In reality it's continuation eDRAM idea they ditched since Broadwell/Haswell. First time saw such thing was in 2003. Thanks Apple, sure thanks.

ATI Mobility Radeon Specs

ATI M6, 144 MHz, 1 Pixel Shaders, 0 Vertex Shaders, 3 TMUs, 1 ROPs, 16 MB DDR, 144 MHz, 64 bit

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[AnarchoPrimitiv]

Maybe we'll finally get laptops without atrocious memory latency.

I'll gladly take latency in exchange for upgradability....this embedded memory thing is just one more step to killing upgradability and forcing consumers to get ripped off on memory and storage

 

[Luke357]

Well sure... not... It ain't something new in mobile space... the heck 99% phones use stacked designs with combo memory since ages... why bother altering the reality with such statement? In reality it's continuation eDRAM idea they ditched since Broadwell/Haswell. First time saw such thing was in 2003. Thanks Apple, sure thanks.

ATI Mobility Radeon Specs

ATI M6, 144 MHz, 1 Pixel Shaders, 0 Vertex Shaders, 3 TMUs, 1 ROPs, 16 MB DDR, 144 MHz, 64 bit

www.techpowerup.com

People love giving Apple credit for things as generic and mundane as on SOC memory...

 

[Ferrum Master]

People love giving Apple credit for things as generic and mundane as on SOC memory...

I am not sure it should be called "Love" than being not familiar with the industry. It should be condemned as it creates false history and perception of things.

I'll gladly take latency in exchange for upgradability....this embedded memory thing is just one more step to killing upgradability and forcing consumers to get ripped off on memory and storage

I see these only in heavily power constrained ultrathins. Because of temperatures. Laptops are weird devices currently... cruising on 80-105C as norm. With RAM besides it it will be clocked with bad latencies to tame the stability for the thermal design witch is usually crippled in the name of the thin looks and saved pennies.

 

[Minus Infinity]

Arrow Lake U will compete against Luna Lake and consumers won't confused at all.

 

[hsew]

Curious as to how this would look with HBM.

 

[Squared]

I see these only in heavily power constrained ultrathins. Because of temperatures. Laptops are weird devices currently... cruising on 80-105C as norm. With RAM besides it it will be clocked with bad latencies to tame the stability for the thermal design witch is usually crippled in the name of the thin looks and saved pennies.

I imagine Arrow Lake will fill the lineup down to 28W TDP, so Lunar Lake only exists for the low power market.

Arrow Lake U will compete against Luna Lake and consumers won't confused at all.

Both have Lion Cove big cores and Skymont little cores, both use a post-Intel 4 process node, and both will probably be branded as Core Ultra 200 series, perhaps 200U for Lunar Lake and 200H for Arrow Lake. Really it looks like the 200-series lineup will be broken up in a way that's extremely similar to prior Intel generations. The only distinction that will be unlike previous generations is the iGPU, since rumors say that Arrow Lake uses Xe cores and Lunar Lake uses Xe2 cores. (Sure Arrow Lake is built on Intel 20A and rumors put Lunar Lake on TSMC N3-something, but as far as we know they offer similar performance. Intel is probably using both because neither one has enough production capacity by itself.)

 

[oooiii222]

I'll gladly take latency in exchange for upgradability....this embedded memory thing is just one more step to killing upgradability and forcing consumers to get ripped off on memory and storage

In fact, the slimmer, longer-lasting and more integrated laptop is the new direction of mobile processors. Intel may need to consider external dram on the gaming laptop, but I think the advantages of using this design on a thin laptop outweigh the disadvantages. In the life cycle of the device, upgrading dram is a very small probability for thin and light, and once these devices need to upgrade dram, their cpu estimated performance is seriously behind The Times. I am a surface user, and I prefer Intel's development direction for mobile processors to be high integration and high power consumption.

 

[Ferrum Master]

I prefer Intel's development direction for mobile processors to be high integration and high power consumption.

What?

 

[Squared]

Lunar Lake will go to premium thin and light laptops and I get the impression those almost always have soldered RAM. And for the ones that don't, I believe Lunar Lake is going to be offered without onboard RAM. So this really doesn't change upgradability.