The optical part has me fascinated reminds me of some of this discussion I had raised about them and me trying to just brainstorm where and how might these be applied that could work and make sense and provide innovation at the same time.
https://www.techpowerup.com/forums/...ged-photonics-for-nvlink.276139/#post-4418550
Another thing related to optic I had mentioned was this.
"I could see a optical path potentially interconnecting them all quickly as well."
That was in regard to FPGA/CPU/GPU chiplets as well as 3Dstacking.
I spoke some about combining DIMM's with chiplets and felt it could be a good if for no other reason than for compression/decompression from those. This is neat though combining TSV and a chiplet and stacking DRAM directly on top of it. Perhaps some optical interconnects in place of TSV could work too. I think that would add another layer of complications though if you had the optical connection on substrate and then used a optical connect in place of TSV you could shave off some latency I think. I don't know maybe that's a bit of what they've already envisioned here though.
Eventually they could maybe have a I/O die in the center and 8 surrounding chiplets on a substrate and below that another substrate connected to it optically with 3D stacked cache. The way it could connect with the substrate above is each chiplet along the edge around the I/O could connect to an optical connection to the 3D stacked cache below. In fact you could even cool it a bit as well because the cache itself can be inverted and cooled on that side regardless of the optical easily enough. The only barrier I see is the cost of optics and how well it can be shrunk down in size at the same time for functionality as an interconnect.
