Zen 6 & RDNA 5 Linked to AMD "Medusa" Ryzen Client CPUs

[T0@st]

The mysterious Zen 6 "Morpheus" processor architecture was leaked accidentally by an AMD engineer's LinkedIn profile—news outlets picked up on this information last April. Naturally, Team Red's next priority is Zen 5—the latest reports suggest that two different chiplet designs are penciled in for mass production within the second quarter of 2024. Last September, insiders claimed that a proposed EPYC 9006 "Venice" CPU series was based on the sixth-gen microarchitecture. Everest/Olrak_29 has revealed various bits of speculative material regarding futuristic "Ryzen Client" processor designs since the start of 2024.

The latest postings to social media posit that AMD has selected an RDNA 5-based integrated graphics solution (possibly occupying a tile), thus "skipping RDNA 4" on their "Medusa" lineup of Ryzen Client processors. Leaked Microsoft documents revealed that its Xbox hardware design division was considering RDNA 5 for next-gen console specs. Medusa's CPU aspect is allegedly populated by Zen 6 "Morpheus" cores—as claimed in a January tweet. A new package design was also riffed on at the time: "Yes, I have teased this before...Medusa will use 2.5D interconnect with a much higher bandwidth," instead of a "traditional" multi-die design. Industry speculation has AMD's Zen 6 client architecture linked to a loose 2025/2026 launch window.



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[Denver]

I think the PS6 specs have no basis whatsoever. But, I assume by then we will have quad-CU design/WGP;

 

[kapone32]

One of the most shocking things about AM5 CPUs are how small they are. I did the Thermalright AM5 bracket on the weekend and was reminded that AM5 Chips are about 2/3 the size of a AM4 chip.

 

[tabascosauz]

One of the most shocking things about AM5 CPUs are how small they are. I did the Thermalright AM5 bracket on the weekend and was reminded that AM5 Chips are about 2/3 the size of a AM4 chip.

The total die size difference is within 10mm^2 between Raphael and Vermeer, and both AM4 and AM5 have the same 40x40 footprint. You were fooled by the stepped IHS and cutouts.

Even 8700G/5700G are virtually the same die size.

I think the PS6 specs have no basis whatsoever. But, I assume by then we will have quad-CU design/WGP;

I agree that the speculation is pretty far out. The language of the rumor is pretty interesting though. Not sure if "2.5D" is referring to a Fanout Link/Infinity Link type solution, or something new.

Also, low power cores on the iGPU tile would be taking a page out of Meteor Lake's book. Not sure how that affects this rumor's reliability, honestly.

 

[kapone32]

The total die size difference is within 10mm^2 between Raphael and Vermeer, and both AM4 and AM5 have the same 40x40 footprint. You were fooled by the stepped IHS and cutouts.

Even 8700G/5700G are virtually the same die size.



I agree that the speculation is pretty far out. The language of the rumor is pretty interesting though. Not sure if "2.5D" is referring to a Fanout Link/Infinity Link type solution, or something new.

Also, low power cores on the iGPU tile would be taking a page out of Meteor Lake's book. Not sure how that affects this rumor's reliability, honestly.

I know it is probably an illusion because of the cutouts. I still marvel at how they fit over 16 billion transistors in that package size.

 

[user556]

It's still multi-die (chiplet) design whether the dies are placed on a traditional interposer or a large area lower density die. Arguably, that's just an interposer of silicon.

 

[Super XP]

AMD has used the same ZEN design with ZEN 1, 2, 3 & 4 and now with 5. Its probably about time they come up with something new and efficient. And it looks like they did, they've been working on ZEN 6 for years. Infinity Fabric is great, just has latency issues. Infinity Link should eliminate that problem as seen in high performance Radeon GPUs.

AMD ZEN 6 - Brand New Micro- Architecture
Next Gen Interconnect (Infinity Link)
* Higher Bandwidth
* Lower Latency
* Increased Energy Efficient
* 32 Core CCX design
* Stack CCDs on top of IODSs?
* New Socket AM6? Though I would prefer if they remain on Socket AM5 as its only about 2 years old. Depends on ZEN 6 release I suppose. And PCIe Gen 5 and DDR5 is pretty new too.

AMD Zen 6 will use Radeon GPU interconnection technology on Ryzen CPUs

And this person seems to know quite a lot on AMDs pathway to ZEN 6.
Its worth the view.

AMD ZEN 6 — Next-gen Chip-lets & Packaging