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Processor | Intel Core 2 Quad Q6600 G0 VID: 1.2125 |
---|---|
Motherboard | GIGABYTE GA-P35-DS3P rev.2.0 |
Cooling | Thermalright Ultra-120 eXtreme + Noctua NF-S12 Fan |
Memory | 4x1 GB PQI DDR2 PC2-6400 |
Video Card(s) | Colorful iGame Radeon HD 4890 1 GB GDDR5 |
Storage | 2x 500 GB Seagate Barracuda 7200.11 32 MB RAID0 |
Display(s) | BenQ G2400W 24-inch WideScreen LCD |
Case | Cooler Master COSMOS RC-1000 (sold), Cooler Master HAF-932 (delivered) |
Audio Device(s) | Creative X-Fi XtremeMusic + Logitech Z-5500 Digital THX |
Power Supply | Chieftec CFT-1000G-DF 1kW |
Software | Laptop: Lenovo 3000 N200 C2DT2310/3GB/120GB/GF7300/15.4"/Razer |
Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, has signed a memorandum of understanding with Intel to explore possible uses for Rambus' family of XDR memory solutions. Rambus plans to dedicate certain technology and design resources to the effort and the evaluation will be done on Intel's silicon process technology. The Company stressed that Intel was only evaluating the technology for possible future uses and has no specific product plans for the XDR memory technology at this time. The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); FlexPhase circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for scalable point-to-point signaling on the data bus.
View at TechPowerUp Main Site
View at TechPowerUp Main Site