Details Revealed about SK Hynix HBM4E, Computing, and Caching Features Integrated Directly

[Nomad76]

SK Hynix, leader in HBM3E memory, has now shared more details about HBM4E. Based on fresh reports by Wccftech and ET News, SK Hynix plans to make an HBM memory type that features multiple things like computing, caching, and network memory, all within the same package. This will make SK Hynix stand out from others. This idea is still in the early stages, but SK Hynix has started getting the design information it needs to support its goals. The reports say that SK Hynix wants to lay the groundwork for a versatile HBM with its upcoming HBM4 design. The company reportedly plans to include a memory controller on board, which will allow new computing abilities with its 7th generation HBM4E memory.

By using SK Hynix's method, everything will be unified as a single unit. This will not only make data transfer faster because there is less space between parts, but it will also make it more energy-efficient. Previously in April, SK Hynix announced that it has been working with TSMC to produce the next generation of HBM and improve how logic chips and HBM work together through advanced packaging. In late May, SK Hynix has disclosed yield details regarding HBM3E for the first time, the memory giant reporting successfully reducing the time needed for mass production of HBM3E chips by 50%, while getting closer to the target yield of 80%. The company plans to keep developing HBM4, which is expected to start mass production in 2026.



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[Philaphlous]

Wow can you imagine if that render of the 1st image was a real chip..good luck cooling that thing..lol

 

[londiste]

Wow can you imagine if that render of the 1st image was a real chip..good luck cooling that thing..lol

What do you mean? It is clearly an illustration, realistically the dies used are BGA, mounted closer etc.
Some filler will be used to not have gaps, to equalize the z-height and surely there are more tricks manufacturers know by now.

HBM-powered GPUs have been a thing for some time. Even in consumer space we had Vega64 - back in 2017:

 

[Random_User]

What do you mean? It is clearly an illustration, realistically the dies used are BGA, mounted closer etc.
Some filler will be used to not have gaps, to equalize the z-height and surely there are more tricks manufacturers know by now.

HBM-powered GPUs have been a thing for some time. Even in consumer space we had Vega64 - back in 2017:

I wonder, if HBM, and especially this particular HBM4E, is as hot as GDDR, or GDDR*X. Not to mention that cooling all the chips with single cooling solution, is much easier and simplier, than hot GDDR chips, scattered across the PCB. Also, it seems like relief in design of power stages, and VRM, compared to the supplying much bigger GDDR area, with all it's long traces, that are both, emmit heat, and are prone to EMI.