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SK hynix has returned to Santa Clara, California to present its full array of groundbreaking AI memory technologies at FMS: the Future of Memory and Storage (FMS) 2024 from August 6-8. Previously known as Flash Memory Summit, the conference changed its name to reflect its broader focus on all types of memory and storage products amid growing interest in AI. Bringing together industry leaders, customers, and IT professionals, FMS 2024 covers the latest trends and innovations shaping the memory industry.
Participating in the event under the slogan "Memory, The Power of AI," SK hynix is showcasing its outstanding memory capabilities through a keynote presentation, multiple technology sessions, and product exhibits.
Keynote Presentation: Envisioning the Future of AI With Leading Memory & Storage Solutions
Keynote presentations have always been a highlight at FMS. The talks act as an important forum for attendees to learn about emerging memory and storage technologies from industry leaders. Due to its leadership in the AI memory field, SK hynix was selected to give a keynote presentation titled "AI Memory and Storage Solution Leadership and Vision for the AI Era" at the newly expanded event.
Held on the first day of FMS 2024, the keynote was delivered by Vice President Unoh Kwon, head of HBM Process Integration (PI) and Vice President Chunsung Kim, head of SSD Program Management Office (PMO). The pair provided insights into the company's DRAM and NAND flash solutions which aim to solve the pain points of generative AI and promote continued development of AI. These pain points include maximizing the efficiency of AI training and inference while minimizing floor space and power utilization for storing data.
Each speaker covered a particular type of memory. Kwon touched on the company's DRAM memory products that are optimized for AI systems such as HBM, CXL, and LPDDR5T. Meanwhile, Kim introduced the company's best-in-class NAND flash storage devices including its SSD and UFS solutions, which will continue to be crucial for AI applications in the future.
In addition to its keynote, SK hynix also held five sessions that took a deeper look into its next-generation products set to solidify the company's AI technology leadership. These sessions covered a variety of topics, including the company's DRAM, SSD, and CXL solutions.
Product Booth: Presenting the Industry's Best AI Memory
SK hynix's booth at FMS 2024 consists of four sections showcasing many of the products which featured in the company's keynote and session talks. One of the booth's highlights is the samples of the 12-layer HBM3E, the next-generation AI memory solution which is expected to be mass-produced in the third quarter of 2024. The company is also holding demonstrations of select products with its partners' systems, highlighting its strong collaboration with various major tech companies.
AI Memory and Storage: Features SK hynix's flagship AI memory products such as samples of its 12-layer HBM3E, which is set to be the same height as the previous 8-layer version under JEDEC standards. The section also includes GDDR6-AiM, a product suitable for machine learning due to its computational capabilities and rapid processing speeds, and the ultra-low power LPDDR5T optimized for on-device AI. Storage solutions on display include the PCIe Gen 5-based eSSD PS1010, which is ideal for AI, big data, and machine learning due to its rapid sequential read speed.
NAND Tech, Mobile, and Automotive: This section includes solutions such as the world's highest 321-layer wafer technology as well as triple-level cell (TLC) and QLC NAND. Mobile technologies are also showcased including ZUFS 4.0, an industry-best NAND product optimized for on-device AI which boosts a smartphone's operating system speed compared to standard UFS.
AI PC and CMS 2.0: Attendees can see a system demonstration of the industry-best SSD PCB01, which is able to efficiently process large AI computing tasks when applied to on-device AI PCs. In addition, CMS 2.0, a next-generation memory solution that boasts equivalent data processing capabilities as a CPU, is applied to a vector database.
OCS, Niagara, and CMM: This section features a demonstration of OCS technology which enhances the data analysis and pooled memory solution Niagara 2.0. It also includes a demonstration of CMM- DDR5, which expands system bandwidth by 50% and capacity by up to 100% compared to systems only equipped with DDR5.
Super Women Conference: Cherishing Diversity in the Memory & Storage Industry
SK hynix also co-sponsored the FMS Super Women Conference, an event held on the sidelines of FMS 2024 which celebrates the achievements of female leaders and promotes diversity in the memory industry. Head of NAND Advanced PI Haesoon Oh, the company's first female executive-level research fellow, delivered a keynote address on the company's next-generation innovations and the importance of understanding diversity.
Paving the Way Forward in the AI Era
At FMS 2024, SK hynix underlined its commitment to lead the industry by providing integrated AI memory solutions and expanding its expertise in the sector. Collaborating with other leading partners, the company will strive to provide customers with the best possible solutions that match their rapidly changing needs.
View at TechPowerUp Main Site | Source
Participating in the event under the slogan "Memory, The Power of AI," SK hynix is showcasing its outstanding memory capabilities through a keynote presentation, multiple technology sessions, and product exhibits.
Keynote Presentation: Envisioning the Future of AI With Leading Memory & Storage Solutions
Keynote presentations have always been a highlight at FMS. The talks act as an important forum for attendees to learn about emerging memory and storage technologies from industry leaders. Due to its leadership in the AI memory field, SK hynix was selected to give a keynote presentation titled "AI Memory and Storage Solution Leadership and Vision for the AI Era" at the newly expanded event.
Held on the first day of FMS 2024, the keynote was delivered by Vice President Unoh Kwon, head of HBM Process Integration (PI) and Vice President Chunsung Kim, head of SSD Program Management Office (PMO). The pair provided insights into the company's DRAM and NAND flash solutions which aim to solve the pain points of generative AI and promote continued development of AI. These pain points include maximizing the efficiency of AI training and inference while minimizing floor space and power utilization for storing data.
Each speaker covered a particular type of memory. Kwon touched on the company's DRAM memory products that are optimized for AI systems such as HBM, CXL, and LPDDR5T. Meanwhile, Kim introduced the company's best-in-class NAND flash storage devices including its SSD and UFS solutions, which will continue to be crucial for AI applications in the future.
In addition to its keynote, SK hynix also held five sessions that took a deeper look into its next-generation products set to solidify the company's AI technology leadership. These sessions covered a variety of topics, including the company's DRAM, SSD, and CXL solutions.
Product Booth: Presenting the Industry's Best AI Memory
SK hynix's booth at FMS 2024 consists of four sections showcasing many of the products which featured in the company's keynote and session talks. One of the booth's highlights is the samples of the 12-layer HBM3E, the next-generation AI memory solution which is expected to be mass-produced in the third quarter of 2024. The company is also holding demonstrations of select products with its partners' systems, highlighting its strong collaboration with various major tech companies.
AI Memory and Storage: Features SK hynix's flagship AI memory products such as samples of its 12-layer HBM3E, which is set to be the same height as the previous 8-layer version under JEDEC standards. The section also includes GDDR6-AiM, a product suitable for machine learning due to its computational capabilities and rapid processing speeds, and the ultra-low power LPDDR5T optimized for on-device AI. Storage solutions on display include the PCIe Gen 5-based eSSD PS1010, which is ideal for AI, big data, and machine learning due to its rapid sequential read speed.
NAND Tech, Mobile, and Automotive: This section includes solutions such as the world's highest 321-layer wafer technology as well as triple-level cell (TLC) and QLC NAND. Mobile technologies are also showcased including ZUFS 4.0, an industry-best NAND product optimized for on-device AI which boosts a smartphone's operating system speed compared to standard UFS.
AI PC and CMS 2.0: Attendees can see a system demonstration of the industry-best SSD PCB01, which is able to efficiently process large AI computing tasks when applied to on-device AI PCs. In addition, CMS 2.0, a next-generation memory solution that boasts equivalent data processing capabilities as a CPU, is applied to a vector database.
OCS, Niagara, and CMM: This section features a demonstration of OCS technology which enhances the data analysis and pooled memory solution Niagara 2.0. It also includes a demonstration of CMM- DDR5, which expands system bandwidth by 50% and capacity by up to 100% compared to systems only equipped with DDR5.
Super Women Conference: Cherishing Diversity in the Memory & Storage Industry
SK hynix also co-sponsored the FMS Super Women Conference, an event held on the sidelines of FMS 2024 which celebrates the achievements of female leaders and promotes diversity in the memory industry. Head of NAND Advanced PI Haesoon Oh, the company's first female executive-level research fellow, delivered a keynote address on the company's next-generation innovations and the importance of understanding diversity.
Paving the Way Forward in the AI Era
At FMS 2024, SK hynix underlined its commitment to lead the industry by providing integrated AI memory solutions and expanding its expertise in the sector. Collaborating with other leading partners, the company will strive to provide customers with the best possible solutions that match their rapidly changing needs.
View at TechPowerUp Main Site | Source
