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SK hynix Inc. announced today that it introduced the industry's best-performing GDDR7, a next-generation graphics memory product. The development of GDDR7 in March comes amid growing interest by global customers in the AI space in the DRAM product that meets both specialized performance for graphics processing and fast speed. The company said that it will start volume production in the third quarter.
The new product comes with the operating speed of 32 Gbps, a 60% improvement from the previous generation and the speed can grow up to 40 Gbps depending on the circumstances. When adopted for the high-end graphics cards, the product can also process data of more than 1.5 TB per second, equivalent to 300 Full-HD movies (5 GB each), in a second.
SK hynix also improved power efficiency by more than 50% compared with the previous generation by adopting the new packaging technology that addresses the heat issue as a result of the ultra-fast processing of data.
The company increased the layer number of the heat-dissipating substrates from four to six, while applying the EMC for the packaging material in a bid to reduce thermal resistance by 74%, compared with the previous generation, while maintaining the size of the product unchanged.
Sangkwon Lee, Head of DRAM Product Planning & Enablement at SK hynix, said that GDDR7 is expected to be adopted by a wider range of applications such as high-specification 3D graphics, AI, high-performance computing and autonomous driving.
View at TechPowerUp Main Site | Source
The new product comes with the operating speed of 32 Gbps, a 60% improvement from the previous generation and the speed can grow up to 40 Gbps depending on the circumstances. When adopted for the high-end graphics cards, the product can also process data of more than 1.5 TB per second, equivalent to 300 Full-HD movies (5 GB each), in a second.
![](https://www.techpowerup.com/img/PPzHqqvHOWhZI9px_thm.jpg)
![](https://www.techpowerup.com/img/JDJujAjYqA9yJHTM_thm.jpg)
SK hynix also improved power efficiency by more than 50% compared with the previous generation by adopting the new packaging technology that addresses the heat issue as a result of the ultra-fast processing of data.
The company increased the layer number of the heat-dissipating substrates from four to six, while applying the EMC for the packaging material in a bid to reduce thermal resistance by 74%, compared with the previous generation, while maintaining the size of the product unchanged.
Sangkwon Lee, Head of DRAM Product Planning & Enablement at SK hynix, said that GDDR7 is expected to be adopted by a wider range of applications such as high-specification 3D graphics, AI, high-performance computing and autonomous driving.
"We will continue to work towards enhancing our position as the most trusted AI memory solution provider by strengthening the premium memory lineup further," Lee said.
View at TechPowerUp Main Site | Source