- Joined
- Aug 19, 2017
- Messages
- 2,671 (0.99/day)
During its Q2 2024 earnings call, NVIDIA confirmed that its upcoming Blackwell-based products are facing low-yield challenges. However, the company announced that it has implemented design changes to improve the production yields of its B100 and B200 processors. Despite these setbacks, NVIDIA remains optimistic about its production timeline. The tech giant plans to commence the production ramp of Blackwell GPUs in Q4 2024, with expected shipments worth several billion dollars by the end of the year. In an official statement, NVIDIA explained, "We executed a change to the Blackwell GPU mask to improve production yield." The company also reaffirmed that it had successfully sampled Blackwell GPUs with customers in the second quarter.
However, NVIDIA acknowledged that meeting demand required producing "low-yielding Blackwell material," which impacted its gross margins. During an earnings call, NVIDIA's CEO Jensen Huang assured investors that the supply of B100 and B200 GPUs will be there. He expressed confidence in the company's ability to mass-produce these chips starting in the fourth quarter. The Blackwell B100 and B200 GPUs use TSMC's CoWoS-L packaging technology and a complex design, which prompted rumors about the company facing yield issues with its designs. Reports suggest that initial challenges arose from mismatched thermal expansion coefficients among various components, leading to warping and system failures. However, now the company claims that the fix that solved these problems was a new GPU photomask, which bumped yields back to normal levels.
View at TechPowerUp Main Site | Source
However, NVIDIA acknowledged that meeting demand required producing "low-yielding Blackwell material," which impacted its gross margins. During an earnings call, NVIDIA's CEO Jensen Huang assured investors that the supply of B100 and B200 GPUs will be there. He expressed confidence in the company's ability to mass-produce these chips starting in the fourth quarter. The Blackwell B100 and B200 GPUs use TSMC's CoWoS-L packaging technology and a complex design, which prompted rumors about the company facing yield issues with its designs. Reports suggest that initial challenges arose from mismatched thermal expansion coefficients among various components, leading to warping and system failures. However, now the company claims that the fix that solved these problems was a new GPU photomask, which bumped yields back to normal levels.
View at TechPowerUp Main Site | Source