JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard

[Nomad76]

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of PS-007A LPDDR5 CAMM2 Connector Performance Standard. The connector, referred to as "LP5CAMM2," is designed to offer a standardized modular LPDDR5 solution with ecosystem support, unlike the traditional LPDDR5 memory-down approach. Developed by JEDEC's JC-11 Committee for Mechanical Standardization, PS-007A is available for free download from the JEDEC website.

As compared to a DDR5 SODIMM connector, benefits of the LP5CAMM2 connector include:

• Better signal integrity (SI) and improved radio frequency interference (RFI)
• To enable a module solution with lower power consumption and increased battery life
• 50% form factor reduction with the similar Z height

"Specifically designed for devices that require a thin, compact form factor, JEDEC is proud to introduce LP5CAMM2, highlighting its interoperability, sustainability, and thermal performance improvements to benefit both the industry and consumers," said Xiang Li, JC-11 Committee Chair.

Industry Support
"Amphenol continues to be committed to enabling the electronics revolution through activities such as our participation in JEDEC's JC-11 committee," said Trent Do, Director of Engineering, Amphenol. He added, "We are delighted to support the LPDDR5 CAMM2 connector development alongside our colleagues in JEDEC."

"Argosy is excited to announce that the LPDDR5 CAMM2 connector we helped develop in JEDEC's JC-11 committee has been successfully completed, specifically designed to offer a standardized modular LPDDR5 solution with ecosystem support, it can be applied in thin, compact form factor or high-performance computing," said Sammy Liu, President of Argosy Research Inc.

"LPDDR5 CAMM2 connector provides superior SI performance, high reliability and serviceability. It facilitates thermal management in HPC and AI application. FIT is proud of being a CAMM2 connector supplier," said Julia Jiang, FIT VP of Sales.

"The performance defined in the standard for the LP5CAMM2 connector provides the margin required for many generations and speeds of the module. It provides a common standard that many connector vendors can support and enables further expansion of the LP5CAMM2 module utilization in Lenovo and the industry," said Tadashi Kosuga, DE & ED, Commercial Subsystem Development at Lenovo.

"LOTES is proud to be an early adopter and key contributor to CAMM connector design," said Mr. Ted Ju, CEO, LOTES. He added, "Our contributions to the development of the PS-007 LPDDR5 CAMM2 Connector underscore our commitment to the development of open industry standards in JEDEC, and we are delighted to have collaborated with our colleagues in JEDEC to enable this low-profile, scalable, and versatile connector solution to meet the demands for a wide range of applications."

"The LP5CAMM2 connector is not only a standard connector, but it also represents a significant innovation from both a system and connector design perspective," said Smark Huo, CEO, Shenzhen Deren Electronic Co., Ltd. He added, "This connector offers huge performance benefits and opens up new paths for future designs, including in applications such as SSDs and GPUs. Our company is proud to have contributed to this achievement and we look forward to collaborating on future standards development efforts with our JEDEC colleagues."

View at TechPowerUp Main Site | Source

 

[bonehead123]

Next headline:

"In anticipation of the mega-uber-gazillions of $$ we will make once the new standard goes into effect and the new modules start selling, the above CEO's etc have purchased and/or placed more orders for more Lear Jets, beachfront villas, Lambo's, plus a few high-maintenance mistresses just for good measure"

 

[Vincero]

All the more reason to hold off upgrading I guess for some.... not that CAMM modules, when they do finally arrive in bulk, will likely be price competitive initially... gotta get that early adopter tax out the way first.

 

[Panther_Seraphin]

These are the things I can see being in the top hand helds/ultra thin laptops due to the increased speeds/lower power and thinner profile overall vs SODIMM. The increase in possible bandwidth and capacity per mm2 is a nice thing especially in the world of hand helds.

I can see SODIMMs living into the DDR6 era until scale of economics really take off to make it viable in the mid to low tier laptops etc.

 

[Metroid]

These are the things I can see being in the top hand helds/ultra thin laptops due to the increased speeds/lower power and thinner profile overall vs SODIMM. The increase in possible bandwidth and capacity per mm2 is a nice thing especially in the world of hand helds.

I can see SODIMMs living into the DDR6 era until scale of economics really take off to make it viable in the mid to low tier laptops etc.

Companies showed a lot about camm2 for desktops in july 2024 then for some reason backed down. There is a Gigabyte tachyon Z890 coming with camm2 so the dream still on but likely will be a top end board with a crazy price, so not worth really, camm2 with accessible price with less than 400 usd will only be when ddr6 arrives in 2026 I think.

 

[azrael]

Companies showed a lot about camm2 for desktops in july 2024 then for some reason backed down. There is a Gigabyte tachyon Z890 coming with camm2 so the dream still on but likely will be a top end board with a crazy price, so not worth really, camm2 with accessible price with less than 400 usd will only be when ddr6 arrives in 2026 I think.

Dream? I call it a nightmare. More precious board space consumed largely unnecessarily. I much much much prefer CUDIMMs for the desktop. Actually, a lot could benefit from being places perpendicular to the motherboard. The bottom side of a motherboard is also largely untapped.

 

[hsew]

These are the things I can see being in the top hand helds/ultra thin laptops due to the increased speeds/lower power and thinner profile overall vs SODIMM. The increase in possible bandwidth and capacity per mm2 is a nice thing especially in the world of hand helds.

I can see SODIMMs living into the DDR6 era until scale of economics really take off to make it viable in the mid to low tier laptops etc.

I doubt we will see DDR6 SODIMMs, given that laptops already have soldered RAM options that are becoming increasingly common.

It is possible we will see DDR7 DIMMs, but, barring another CUDIMM-esque innovation, we will almost certainly not see DDR8 DIMMs except in server applications.

 

[Vincero]

Dream? I call it a nightmare. More precious board space consumed largely unnecessarily. I much much much prefer CUDIMMs for the desktop. Actually, a lot could benefit from being places perpendicular to the motherboard. The bottom side of a motherboard is also largely untapped.

1 CAMM2 module = 2 DIMMs

They are not as wide as a DIMM and arguably wouldn't take up much more space than 4 DIMM slots on a motherboard.

Interesting you make the point about the bottom side of motherboard - in previous discussion about this I've mentioned the same and suspect that it could be used to allow easily for 2 x CAMM2 modules for either extended RAM capacity (i.e. like having 4 DIMMs installed), or bringing in quad-channel RAM as a normal standard on higher end boards. Seeing as there is so much discussion about memory bandwidth limitations holding back performance on some platforms, this would seem to be a 'when' more than an 'if' scenario.... they'll only be able to go so far with memory clock rate before they'll have to go wider (like CPUs no longer chasing more MHz and doing more cores).

 

[TumbleGeorge]

We have almost reached mainstream computers with 256GB RAM (4*64GB). Let someone else put 4*64GB camm2 modules on top of each other and bake each other, it won't be me.