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Ventiva, the leader in thermal solutions, today announced its ICE9 thermal management suite can now cool laptops that operate at up to 40 watts TDP (Thermal Design Power), enabling thinner, faster, and utterly silent computing devices—without the compromises of traditional, fan-based cooling systems. This allows the ICE9 solution to cool the powerful CPUs required for the next-generation of feature-rich, AI-enabled, high-performance laptops.
The ICE9 thermal management suite is based on Ventiva's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans, using intelligent software control to enable optimal performance in electronics devices—without any moving parts, noise or vibration.
The ultra-compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops on the market today. Its space-efficient form factor not only supports sleek, thin designs but also provides original equipment manufacturers (OEMs) with the flexibility to integrate additional functionalities into their products.
Ventiva has published a new white paper, Enabling High Performance Silent Computing: A Breakthrough in Laptop Thermal Management, that explores the critical balance between managing heat dissipation and achieving quiet laptop operation. As processors become more powerful, they generate higher thermal output, necessitating innovative cooling solutions that do not compromise form factor or acoustics. It peels back the layers to share how enterprises evaluate these options to support their current and emerging strategies.
Ventiva is working with select partners to productize the ICE9 thermal management suite for up to 40 W TDP in 2027. The ICE9 solution for up to 25 W TDP is available now.
View at TechPowerUp Main Site | Source
The ICE9 thermal management suite is based on Ventiva's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans, using intelligent software control to enable optimal performance in electronics devices—without any moving parts, noise or vibration.
The ultra-compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops on the market today. Its space-efficient form factor not only supports sleek, thin designs but also provides original equipment manufacturers (OEMs) with the flexibility to integrate additional functionalities into their products.
Ventiva has published a new white paper, Enabling High Performance Silent Computing: A Breakthrough in Laptop Thermal Management, that explores the critical balance between managing heat dissipation and achieving quiet laptop operation. As processors become more powerful, they generate higher thermal output, necessitating innovative cooling solutions that do not compromise form factor or acoustics. It peels back the layers to share how enterprises evaluate these options to support their current and emerging strategies.
Ventiva is working with select partners to productize the ICE9 thermal management suite for up to 40 W TDP in 2027. The ICE9 solution for up to 25 W TDP is available now.
View at TechPowerUp Main Site | Source
