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System Name | HTC's System |
---|---|
Processor | Ryzen 5 5800X3D |
Motherboard | Asrock Taichi X370 |
Cooling | NH-C14, with the AM4 mounting kit |
Memory | G.Skill Kit 16GB DDR4 F4 - 3200 C16D - 16 GTZB |
Video Card(s) | Sapphire Pulse 6600 8 GB |
Storage | 1 Samsung NVMe 960 EVO 250 GB + 1 3.5" Seagate IronWolf Pro 6TB 7200RPM 256MB SATA III |
Display(s) | LG 27UD58 |
Case | Fractal Design Define R6 USB-C |
Audio Device(s) | Onboard |
Power Supply | Corsair TX 850M 80+ Gold |
Mouse | Razer Deathadder Elite |
Software | Ubuntu 20.04.6 LTS |
omg... THE DIE OF THE CHIP. NOT the whole chip. the DIE. the DIE is covered by the IHS so no one can see it to prove or disprove me wrong or right.
its totally obvious that the whole chip is bigger and so is the socket.
from what i've read intel is trying to use the same hole pattern as the 775 uses. MAYBE that has changed.
im not trying to be mean but like 3-4 people have misunderstood me now. im JUST clarifying what i meant.
Sorry, dude: i miss understood you
As for the hole pattern, since in the LGA775 its so much bigger then the actual socket, it would stand to reason that it would be compatible with the Nehalem socket, despite it being quite a bit bigger: my guess is the Motherboard makers will have the final say about this.