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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
World class flash memory module manufacturer, Silicon Power announces today the new Xpower DDR3 overclocking series memory module. Complete with dual (2GBx2) and tri-channel (2GBx3) packs, it is available in DDR3-1600, 1800, 2000, 2133 MHz variants. Completely compatible with Intel quad-core Core i5 and Core i7 platforms, Xpower DDR3 modules use "oblique groove manufacturing process" and pure aluminum heat sink to resolve heat dissipation issues. In addition, Xpower DDR3 applies 1.65V to maintain high speed and stability to meet the needs of enthusiasts and gamers.
The oblique groove heat sink design of Silicon Power's Xpower DDR3 overclocking series increases the heat dissipation area of the heat sink and can provide up to twice the heat dissipation ability over standard heat sinks. In addition, the Xpower DDR3 series use 8-layered PCBs and new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer.
Silicon Power's Xpower DDR3 overclocking series are 100% tested for dual and tri-channel operation. They are high performance, stability and compatibility guaranteed. Comprising of superior specifications, speed and low latencies, it is the boost juice for all-round performance needs. The high memory module capacity is perfect for photo / video editing and gaming requirements so users can fully enjoy quad-core performances on their Intel Core i5 and Core i7 platforms.
Product specifications:
New generation of heat sink featuring ultra efficient heat dissipation
1. Oblique groove heatsink to increase surface areas on top and bottom
2. All aluminum heatsink for maximum heat dissipation. It effectively reduces up to 6~10 degrees under load. Fashionable gold alloy look for futuristic looks
View at TechPowerUp Main Site
The oblique groove heat sink design of Silicon Power's Xpower DDR3 overclocking series increases the heat dissipation area of the heat sink and can provide up to twice the heat dissipation ability over standard heat sinks. In addition, the Xpower DDR3 series use 8-layered PCBs and new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer.
Silicon Power's Xpower DDR3 overclocking series are 100% tested for dual and tri-channel operation. They are high performance, stability and compatibility guaranteed. Comprising of superior specifications, speed and low latencies, it is the boost juice for all-round performance needs. The high memory module capacity is perfect for photo / video editing and gaming requirements so users can fully enjoy quad-core performances on their Intel Core i5 and Core i7 platforms.
Product specifications:
- Memory module type: Xpower DDR3 Memory
- Pins: 240Pin Long-DIMM
- Frequency: DDR3-1600MHz / 1800MHz / 2000MHz / 2133MHz
- ECC function: Unbuffer Non-ECC Memory
- Capacity: 4GB(2GBx2) / 6GB(2GBx3)
- Flash module spec.: 128Mx8 (bit) (single module capacity)
- Operating voltage: 1.65 V
- CAS Latency: 8 (1600MHz) / 9 (1800/2000/2133MHz)
- Warranty: Lifetime warranty
New generation of heat sink featuring ultra efficient heat dissipation
1. Oblique groove heatsink to increase surface areas on top and bottom
2. All aluminum heatsink for maximum heat dissipation. It effectively reduces up to 6~10 degrees under load. Fashionable gold alloy look for futuristic looks
View at TechPowerUp Main Site
and how it stacks up to other kits in the same range