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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3003, a compact embedded IoT system designed around the tiny VIA EPIA-P910 Pico-ITX board. Combining low power, rich connectivity and high performance 64-bit computing in a ruggedized design, the VIA AMOS-3003 delivers all the latest features and digital media standards required in data collection terminals for in-vehicle control as well as machine to machine controllers in a host of industrial automation applications.
Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.
"The proliferation of wireless connectivity to the cloud is opening up exciting new possibilities for capturing more real-time IoT data in order to improve operating efficiency,' said Epan Wu, Head of VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA AMOS-3003 provides a robust system with wide power input support and flexible connectivity options to enhance the remote collection and processing of this data in the most demanding environments."
Software solutions packs are available the VIA AMOS-3003 include Microsoft Win7, Win8, and WES7 as well as Linux OS. Customers can also take advantage of VIA's industry leading hardware and software support, including our SMART ETK (Embedded Tool Kit) to create customized designs with a quick time to market.
VIA AMOS-3003
Leveraging the low power consumption and digital excellence of the VIA EPIA-P910 Pico-ITX board, featuring a 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H MSP, the AMOS-3003 combines rugged design with rich network connectivity including dual Gigabit Ethernet (GLAN), and optional Wi-Fi, GPS, and 3G networking. Storage is provided through support for an mSATA module or a standard 2.5" SATA HDD/SSD drive while the system supports up to 8GB of DDR3-1333 memory.
Comprehensive I/O functions on front, left side, and rear panels make the AMOS-3003 a flexible solution for a wide range of embedded applications. Rear I/O includes, 1 HDMI port, 1 VGA port, 2 USB 3.0 ports, 2 USB 2.0 ports, 2 GLAN ports, Line-in/out/mic-in, as well as power button and the power input connector. Left side I/O includes 3 COM ports and 1 9-pin D-Sub connector for 8-bit GPIO while front panel I/O includes 4 antenna holes. On board I/O includes 1 mSATA connector, 1 SATA connector, 2 SIM slots and 2 Mini-PCIe slots for further expansion options.
For more information about the VIA AMOS-3003, please visit this page.
View at TechPowerUp Main Site
Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.
"The proliferation of wireless connectivity to the cloud is opening up exciting new possibilities for capturing more real-time IoT data in order to improve operating efficiency,' said Epan Wu, Head of VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA AMOS-3003 provides a robust system with wide power input support and flexible connectivity options to enhance the remote collection and processing of this data in the most demanding environments."
Software solutions packs are available the VIA AMOS-3003 include Microsoft Win7, Win8, and WES7 as well as Linux OS. Customers can also take advantage of VIA's industry leading hardware and software support, including our SMART ETK (Embedded Tool Kit) to create customized designs with a quick time to market.
VIA AMOS-3003
Leveraging the low power consumption and digital excellence of the VIA EPIA-P910 Pico-ITX board, featuring a 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H MSP, the AMOS-3003 combines rugged design with rich network connectivity including dual Gigabit Ethernet (GLAN), and optional Wi-Fi, GPS, and 3G networking. Storage is provided through support for an mSATA module or a standard 2.5" SATA HDD/SSD drive while the system supports up to 8GB of DDR3-1333 memory.
Comprehensive I/O functions on front, left side, and rear panels make the AMOS-3003 a flexible solution for a wide range of embedded applications. Rear I/O includes, 1 HDMI port, 1 VGA port, 2 USB 3.0 ports, 2 USB 2.0 ports, 2 GLAN ports, Line-in/out/mic-in, as well as power button and the power input connector. Left side I/O includes 3 COM ports and 1 9-pin D-Sub connector for 8-bit GPIO while front panel I/O includes 4 antenna holes. On board I/O includes 1 mSATA connector, 1 SATA connector, 2 SIM slots and 2 Mini-PCIe slots for further expansion options.
For more information about the VIA AMOS-3003, please visit this page.
View at TechPowerUp Main Site