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The volume of data traffic is growing by the minute, and ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is meeting colossal storage demands with its latest portfolio built for space-restricted embedded, industrial, and automotive systems. ATP shows off its extensive array of flash memory and storage products at the Flash Memory Summit 2018 in Sta. Clara, USA from August 7 to 9.
"We are seeing data propelling the transformation of cities and nations, and we need effective solutions of handling, storing and analyzing data to deliver rapid, actionable insights that will improve the way we live and do business," noted Marco Mezger, ATP Vice President of Global Marketing. "As the Internet of Things (IoT) adoption gains momentum, systems are diminishing in size so memory and storage solutions have to adapt. ATP is thoroughly amplifying reliability, endurance, performance and capacity in its embedded and removable flash products while keeping them compact and portable," he added.
The ATP industrial e.MMC will be displayed at the FMS for the first time. This soldered-down tiny storage device, which adheres to JEDEC e.MMC v5.1 Standard (JESD84-B51), delivers solid performance and reliability in challenging operating environments. Smaller than a typical postage stamp, the ATP industrial e.MMC packs up to 128 GB of 3D NAND flash in a 153-ball fine pitch ball grid array (FBGA) package that integrates a MultiMedia Card (MMC) interface, flash memory and controller. The industrial operating temperature rating (-40°C to 85°C) allows the e.MMC to withstand extreme temperatures in harsh environments and a special SRAM Soft Error Detection Mechanism effectively ensures that soft errors do not put data or the device at risk.
ATP SD and microSD cards built with 3D NAND are small and light yet hold vast amounts of data. Easy to insert and remove from a host system, these memory cards enable fast, convenient and network-independent data transfer and access. ATP SD and microSD cards ensure your data is available on demand, whether it stays at the edge or eventually goes to the cloud. Built for the rigors of industrial and automotive applications, these hardy devices can thrive against intense cold or scorching heat, vibration/shock, humidity, sudden power loss and other challenges. They are ideal for in-vehicle infotainment (IVI), event data recording, Advanced Driver Assistance Systems (ADAS), and other applications requiring high performance, capacity, reliability and endurance. Random read-write performance complies with SDA A1 specifications and is currently among the highest available today.
ATP industrial M.2 NVMe modules deliver furiously fast performance but stay cool even under the toughest workloads and perform dependably in tough environments within a wide temperature range of -40°C to 85°C. The Dynamic Throttling Mechanism intelligently prevents overheating without drastically impacting performance. ATP NVMe is all the rage in industrial storage for its lean M.2 2280 form factor that loads up to 1 TB memory, making it ideal for compact and fanless embedded systems. Designed for a PCIe Generation 3.0 x4 lane high-speed interface, ATP NVMe modules deliver a bandwidth of up to 32 Gb/s (8 Gb/s per lane), which is four to six times the data transfer speed of previous-generation AHCI protocol on Serial ATA drives.
View at TechPowerUp Main Site
"We are seeing data propelling the transformation of cities and nations, and we need effective solutions of handling, storing and analyzing data to deliver rapid, actionable insights that will improve the way we live and do business," noted Marco Mezger, ATP Vice President of Global Marketing. "As the Internet of Things (IoT) adoption gains momentum, systems are diminishing in size so memory and storage solutions have to adapt. ATP is thoroughly amplifying reliability, endurance, performance and capacity in its embedded and removable flash products while keeping them compact and portable," he added.
The ATP industrial e.MMC will be displayed at the FMS for the first time. This soldered-down tiny storage device, which adheres to JEDEC e.MMC v5.1 Standard (JESD84-B51), delivers solid performance and reliability in challenging operating environments. Smaller than a typical postage stamp, the ATP industrial e.MMC packs up to 128 GB of 3D NAND flash in a 153-ball fine pitch ball grid array (FBGA) package that integrates a MultiMedia Card (MMC) interface, flash memory and controller. The industrial operating temperature rating (-40°C to 85°C) allows the e.MMC to withstand extreme temperatures in harsh environments and a special SRAM Soft Error Detection Mechanism effectively ensures that soft errors do not put data or the device at risk.
ATP SD and microSD cards built with 3D NAND are small and light yet hold vast amounts of data. Easy to insert and remove from a host system, these memory cards enable fast, convenient and network-independent data transfer and access. ATP SD and microSD cards ensure your data is available on demand, whether it stays at the edge or eventually goes to the cloud. Built for the rigors of industrial and automotive applications, these hardy devices can thrive against intense cold or scorching heat, vibration/shock, humidity, sudden power loss and other challenges. They are ideal for in-vehicle infotainment (IVI), event data recording, Advanced Driver Assistance Systems (ADAS), and other applications requiring high performance, capacity, reliability and endurance. Random read-write performance complies with SDA A1 specifications and is currently among the highest available today.
ATP industrial M.2 NVMe modules deliver furiously fast performance but stay cool even under the toughest workloads and perform dependably in tough environments within a wide temperature range of -40°C to 85°C. The Dynamic Throttling Mechanism intelligently prevents overheating without drastically impacting performance. ATP NVMe is all the rage in industrial storage for its lean M.2 2280 form factor that loads up to 1 TB memory, making it ideal for compact and fanless embedded systems. Designed for a PCIe Generation 3.0 x4 lane high-speed interface, ATP NVMe modules deliver a bandwidth of up to 32 Gb/s (8 Gb/s per lane), which is four to six times the data transfer speed of previous-generation AHCI protocol on Serial ATA drives.
View at TechPowerUp Main Site