- Joined
- Oct 9, 2007
- Messages
- 47,449 (7.50/day)
- Location
- Hyderabad, India
| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products,today announced its lineup of DDR4-3200 32 GB Low Profile industrial Mini-DIMMs. SMART has several new 32 GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.
SMART's DDR4-3200 32 GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 °C to +85 °C which makes SMART's DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.
DDR4 Mini-DIMMs are designed with more power and ground pins compared to SO-DIMMs. Mini-DIMMs are JEDEC-standard, an industry standard which SMART originally helped to develop. The extra power and ground pins ensure robust system operation under harsh conditions. Systems with Mini-DIMMs often go through NEBS compliance testing, ensuring conformance of a network product to the requirements of the Network Equipment Building System (NEBS) standard. Compliance to this standard indicates that a network product or telecommunications equipment performs at its optimum capacity.
SMART's high-density industrial Mini-DIMM are offered in ULP height (17.78 mm) and VLP height (18.75 mm) to accommodate a wide variety of system board height requirements. Mini-DIMMs are supported by connectors from Molex and Foxconn, allowing Mini-DIMMs to be either mounted vertically, angled at 22.5°, or at a right angle to the system board. They also have robust latching mechanisms designed for a seven or more year product lifecycle. Mini-DIMMs are one of the most versatile memory solutions being used today for leading-edge telecom and networking applications.
These new Mini-DIMMs add to an already robust product family line-up of DDR4 Mini-DIMMs offered by SMART. For more information please contact SMART Modular Technologies (www.smartm.com).
SMART will be showcasing its line of Specialty Memory solutions at Embedded World Exhibition and Conference 2020 from February 25-27 at the Nuremberg Messe in Germany. SMART's stand is located in Hall 2, stand 2-555. Attendees are encouraged to visit the stand to learn about SMART's full line of Specialty Memory products for the embedded industry.
View at TechPowerUp Main Site
SMART's DDR4-3200 32 GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 °C to +85 °C which makes SMART's DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.
DDR4 Mini-DIMMs are designed with more power and ground pins compared to SO-DIMMs. Mini-DIMMs are JEDEC-standard, an industry standard which SMART originally helped to develop. The extra power and ground pins ensure robust system operation under harsh conditions. Systems with Mini-DIMMs often go through NEBS compliance testing, ensuring conformance of a network product to the requirements of the Network Equipment Building System (NEBS) standard. Compliance to this standard indicates that a network product or telecommunications equipment performs at its optimum capacity.
SMART's high-density industrial Mini-DIMM are offered in ULP height (17.78 mm) and VLP height (18.75 mm) to accommodate a wide variety of system board height requirements. Mini-DIMMs are supported by connectors from Molex and Foxconn, allowing Mini-DIMMs to be either mounted vertically, angled at 22.5°, or at a right angle to the system board. They also have robust latching mechanisms designed for a seven or more year product lifecycle. Mini-DIMMs are one of the most versatile memory solutions being used today for leading-edge telecom and networking applications.
These new Mini-DIMMs add to an already robust product family line-up of DDR4 Mini-DIMMs offered by SMART. For more information please contact SMART Modular Technologies (www.smartm.com).
SMART will be showcasing its line of Specialty Memory solutions at Embedded World Exhibition and Conference 2020 from February 25-27 at the Nuremberg Messe in Germany. SMART's stand is located in Hall 2, stand 2-555. Attendees are encouraged to visit the stand to learn about SMART's full line of Specialty Memory products for the embedded industry.
View at TechPowerUp Main Site