This is a perfect example of how Corsair will ship the worst chips it can get away with. That is some really poor b-die. Do Corsair do binning? Yes. But they don't go about it the same way as quality brands, they bin to see what they can get away with.
It's nice that it is b-die so at least the user can tighten up some of the timings more (hopefully Trfc will go way down like it should on b-die) but lets be real here - how many of these kits will actually be supplied with b-die. I suspect that this kit was hand picked by Corsair to go out for review - something they have done for many many years - supply reviewers with kits that tend to be much better than what will generally be on sale. I make that assumption in this case not knowing whether corsair sent these, or if tech powerup bought them.
Sorry, but it is not about Samsung B-Die chips on this kit despite what Taiphoon Burner does not display, moreover on this subject it is not the first time that I see this software being wrong especially when these are chips from lesser-known brands such as Nanya or SpecTek (which today only act as a subcontractor manufacturer of Micron chips, which is the problem with Taiphoon Burner) and as well as the recognition of all the chips that have been/are or will be rebranded, because in this specific case (Corsair RGB PRO SL v4.31), they are indeed Samsung-made chips but which have been rebranded (just look at the inscriptions on the chips in the review to see it) and the big concern for the kits using rebranded chips (Corsair, Kingston, etc.) or manufactured by subcontractors (Spectek, Nanya, etc.), these are that the brands of respective origins of each of the known chip models voluntarily forget to communicate certain IDs and codes recognition of their different series of chips so that rebranders and sub-manufacturers (under contracts) do not have fun exceeding the production quotas allocated (for each of the chip models) by the proprietary brands (Samsung, Micron and SKhynix), the latter assigning them unique serial numbers for each of the chips on minimum / maximum ranges defined, which allows the final proprietary brands to keep full control over their rebranders and sub-manufacturers. To understand which chip model it really is on Corsair rebranded chips, it is not very complicated: just read the three letters at the start of the second line: the first two letters correspond to the first two letters of the original brand (so "HY" for Hynix, "MI" for Micron and "SA" for Samsung) and finally the third letter defines the chip model, example: "D" for D-Die (Samsung or Micron) or DJR for Hynix. Don to definitively remove the mystery of the kit's chips in this review, it is marked "SAC" on the rebranded Corsair chips, which means that it is Samsung C-Die, chips much less efficient in overclocking than the B-Die and which moreover have a behavior of more vis-a-vis the increase of tension: on the C-Die, one must especially not exceed the 1.40v (even well cooled) because it is counterproductive: it loses in stability and therefore in OC, and generally some kits in Samsung C-Die can give their maximum in overclocking to 1,35v and others directly to 1,30v and the latter start to lose in overclockability from 1,31~1,32v, which makes these kits generally not a good go-to kit for overclocking.