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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | Gigabyte B550 AORUS Elite V2 |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 16GB DDR4-3200 |
Video Card(s) | Galax RTX 4070 Ti EX |
Storage | Samsung 990 1TB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
Thermaltake released its highest-capacity dual-channel (2-module) DDR4 memory kit, the ToughRAM XG RGB R016R432GX2-3600C18A. This kit uses modules that are a swansong of DDR4 in terms of capacity—32 GB x 2. The 32 GB module is dual-rank, and only compatible with some of the later generations of Intel Core and AMD Ryzen processors that feature memory controllers with support for up to 128 GB of memory in total. On its part, Thermaltake claims that the modules were only tested to be compatible with Intel 10th Gen and 11th Gen Core; and AMD Ryzen 2000 series and above. In terms of performance, the ToughRAM XG RGB R016R432GX2-3600C18 packs an Intel XMP 2.0 profile for DDR4-3600 with 18-22-22-42 + CR2T timings, and 1.35 V module voltage. The module is aesthetically identical to the ToughRAM XG RGB series the company debuted in March 2021.
View at TechPowerUp Main Site

View at TechPowerUp Main Site