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A technology tipster has been dropping multiple tidbits this week about Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset - this follows a leak (from a different source, going back to mid-April) about the next generation Adreno 750 GPU getting tuned up for a battle against Apple's Bionic A17 in terms of graphics benchmarks. The latest leak points to the GPU being clocked at 900 MHz, rather than the rumored higher figure of 1.0 GHz speed (garnered from tests at Qualcomm's labs). The focus has now turned to the next generation flagship Snapdragon's CPU aspect, with information emerging about core clock speeds and multiple cluster configurations.
Revegnus suggests that the Snapdragon 8 Gen 3 (SD8G3) chipset will be packing a large primary core in the shape of Arm's Cortex-X4 CPU with a reported maximum clock speed of 3.40 GHz. Leaks from the past have posited that the SD8G3 would feature a fairly standard 1x Large + 5x Big + 2x Small CPU core layout (with clocks predicted to be: large Cortex X4 at 3.2 GHz, big Cortex-A720 at 3.0 GHz, and small Cortex-A520 at 2.0 GHz). An insider source has provided Revegnus with additional information about two different CPU core configurations - 1+5+2 and 2+4+2 - it is theorized that smartphone manufacturers will be offered the latter layout as an exclusive option for special edition flagship phones. The more powerful 2+4+2 variant is said to sacrifice a big core (A720) in favor of a dual Cortex X4 headliner, although the resultant thermal output of twin large cores could prove to be problematic.
The tipster has procured some very early information relating to an unannounced Snapdragon 8 Gen 4 (SD8G4) mobile chipset. The next-next generation SoC is said to be in development at Qualcomm's NUVIA technology design specialist division - located in San Diego, California. Their extremely powerful Phoenix CPU core is destined to feature within the SD8G4's layout according to multiple insider sources. Revegnus reckons that TSMC has been selected as the manufacturing partner for the SD8G4 project, with the foundry's enhanced 3 nm process (N3E) set for the production line.
View at TechPowerUp Main Site | Source
Revegnus suggests that the Snapdragon 8 Gen 3 (SD8G3) chipset will be packing a large primary core in the shape of Arm's Cortex-X4 CPU with a reported maximum clock speed of 3.40 GHz. Leaks from the past have posited that the SD8G3 would feature a fairly standard 1x Large + 5x Big + 2x Small CPU core layout (with clocks predicted to be: large Cortex X4 at 3.2 GHz, big Cortex-A720 at 3.0 GHz, and small Cortex-A520 at 2.0 GHz). An insider source has provided Revegnus with additional information about two different CPU core configurations - 1+5+2 and 2+4+2 - it is theorized that smartphone manufacturers will be offered the latter layout as an exclusive option for special edition flagship phones. The more powerful 2+4+2 variant is said to sacrifice a big core (A720) in favor of a dual Cortex X4 headliner, although the resultant thermal output of twin large cores could prove to be problematic.
The tipster has procured some very early information relating to an unannounced Snapdragon 8 Gen 4 (SD8G4) mobile chipset. The next-next generation SoC is said to be in development at Qualcomm's NUVIA technology design specialist division - located in San Diego, California. Their extremely powerful Phoenix CPU core is destined to feature within the SD8G4's layout according to multiple insider sources. Revegnus reckons that TSMC has been selected as the manufacturing partner for the SD8G4 project, with the foundry's enhanced 3 nm process (N3E) set for the production line.
View at TechPowerUp Main Site | Source
