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| System Name | RBMK-1000 |
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Essencore, an emerging memory company, with its flagship consumer facing brand KLEVV is excited to announce its participation at COMPUTEX Taipei 2023. Essencore will showcase its B2B business solutions and B2C consumer products at the Expo from May 30th to June 2nd, 2023. COMPUTEX Taipei 2023 is back after a few years of absence due to the pandemic.Using this occasion to make a grand return, Essencore will showcase some of the most advanced memory and storage solutions built to dominate the global market.
KLEVV, Essencore's consumer brand, is thrilled to showcase its latest innovative products designed for gamers, content creators, and tech enthusiasts. The highlight of on-site demonstration includes the newly released CRAS V RGB and BOLT V DDR5 gaming/overclocking memory with a maximum clock speed of up to 8600MT/s, and a new DDR5 memory with 48 GB capacity per DIMM.
Furthermore, KLEVV will debut their upcoming products including the all new CRAS C950 PCIe Gen5x4 M.2 SSD with a unique new aluminium heatsink design, providing exceptional heat dissipation while offering sequential read speeds of up to 12000 MB/s, the S710 M.2 SSD compatible with the popular Steam Deck console, as well as the CRAS C910 RGB Gen4x4 M.2 SSD, providing splendid lighting effect and read speeds of up to 7400 MB/s.
Essencore's participation in COMPUTEX Taipei 2023 reinforces the commitment to delivering high-quality and innovative technology solutions to both business and consumer markets. KLEVV as Essencore's flagship consumer product range is po12000 MB be at the forefront of the memory market, eager to introduce top shelf products with unparalleled performance and reliability to users worldwide.
KLEVV cordially invites all media friends, potential buyers, and fans to visit its booth at, #N0808, 4th floor of Taipei Nangang Exhibition Center, Hall 1.
View at TechPowerUp Main Site
KLEVV, Essencore's consumer brand, is thrilled to showcase its latest innovative products designed for gamers, content creators, and tech enthusiasts. The highlight of on-site demonstration includes the newly released CRAS V RGB and BOLT V DDR5 gaming/overclocking memory with a maximum clock speed of up to 8600MT/s, and a new DDR5 memory with 48 GB capacity per DIMM.
Furthermore, KLEVV will debut their upcoming products including the all new CRAS C950 PCIe Gen5x4 M.2 SSD with a unique new aluminium heatsink design, providing exceptional heat dissipation while offering sequential read speeds of up to 12000 MB/s, the S710 M.2 SSD compatible with the popular Steam Deck console, as well as the CRAS C910 RGB Gen4x4 M.2 SSD, providing splendid lighting effect and read speeds of up to 7400 MB/s.
Essencore's participation in COMPUTEX Taipei 2023 reinforces the commitment to delivering high-quality and innovative technology solutions to both business and consumer markets. KLEVV as Essencore's flagship consumer product range is po12000 MB be at the forefront of the memory market, eager to introduce top shelf products with unparalleled performance and reliability to users worldwide.
KLEVV cordially invites all media friends, potential buyers, and fans to visit its booth at, #N0808, 4th floor of Taipei Nangang Exhibition Center, Hall 1.
View at TechPowerUp Main Site