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SK hynix Inc. announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world. The samples were delivered ahead of schedule based on SK hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process for the customers. SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market.
The 12-layer HBM4 provided as samples this time feature the industry's best capacity and speed which are essential for AI memory products. The product has implemented bandwidth capable of processing more than 2 TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5 GB each) in a second, which is more than 60 percent faster than the previous generation, HBM3E.
SK hynix also adopted the Advanced MR-MUF process to achieve the capacity of 36 GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat dissipation.
Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024. SK hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner.
"We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands," said Justin Kim, President & Head of AI Infra at SK hynix. "We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider."
View at TechPowerUp Main Site
The 12-layer HBM4 provided as samples this time feature the industry's best capacity and speed which are essential for AI memory products. The product has implemented bandwidth capable of processing more than 2 TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5 GB each) in a second, which is more than 60 percent faster than the previous generation, HBM3E.
SK hynix also adopted the Advanced MR-MUF process to achieve the capacity of 36 GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat dissipation.
Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024. SK hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner.
"We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands," said Justin Kim, President & Head of AI Infra at SK hynix. "We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider."
View at TechPowerUp Main Site
