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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
ASUS today introduced the WS X299 SAGE/10G, a step up variant of the WS X299 SAGE it launched back in Q4-2017. As you can tell from the model name, this board's star-attraction is 10 Gbps Ethernet. It features not one, but two 10 GbE interfaces, replacing the dual 1 GbE interfaces of the original. These interfaces aren't backed by low-cost controllers, but the Intel X550-AT2 "Sageville," which is an $80 chip by itself, and drives both interfaces.
ASUS also used the opportunity to improve the CPU VRM a bit. Although it's still the same combination of chokes and MOSFETs, pulling power from two 8-pin EPS connectors, ASUS improved the secondary VRM heatsink, which pulls heat from the main heatsink over a flattened heat-pipe. This heatsink is now made of a dense aluminium fin-stack like the main heatsink, a section of which protrudes all the way to the rear I/O shield. The rear I/O now consists of four USB 3.1 gen 1 ports, two USB 3.1 gen 2 ports (including a type-C port), and the 8-channel HD audio cluster, besides the two 10 GbE ports. The rest of the board's feature-set is unchanged from the original. We expect a $100 premium over the original's price.
View at TechPowerUp Main Site
ASUS also used the opportunity to improve the CPU VRM a bit. Although it's still the same combination of chokes and MOSFETs, pulling power from two 8-pin EPS connectors, ASUS improved the secondary VRM heatsink, which pulls heat from the main heatsink over a flattened heat-pipe. This heatsink is now made of a dense aluminium fin-stack like the main heatsink, a section of which protrudes all the way to the rear I/O shield. The rear I/O now consists of four USB 3.1 gen 1 ports, two USB 3.1 gen 2 ports (including a type-C port), and the 8-channel HD audio cluster, besides the two 10 GbE ports. The rest of the board's feature-set is unchanged from the original. We expect a $100 premium over the original's price.
![](https://www.techpowerup.com/img/swbfbnnh4Jl1y0VJ_thm.jpg)
![](https://www.techpowerup.com/img/v5Crqgydr4uEd3g8_thm.jpg)
![](https://www.techpowerup.com/img/g0EwUHkF5VdCHi6j_thm.jpg)
![](https://www.techpowerup.com/img/2lDc3AjllTYLPixJ_thm.jpg)
View at TechPowerUp Main Site