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- Oct 9, 2007
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- Hyderabad, India
System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
ASUS' mainline motherboard lineup based on the upcoming Intel Z170 chipset could retain the black + glossy white design scheme from the company's X99 mainline motherboard series. The company showed off its premium upper-mid segment Z170-Pro motherboard, which could be sold around the $170-$190 price range. This socket LGA1151 motherboard offers a 16-phase CPU VRM, a new high-capacity VRM heatsink design; and four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4-3000 memory.
Expansion slots include three PCI-Express 3.0 x16 (x16/NC/NC or x8/x8/NC or x8/x4/x4), and four PCI-Express 2.0 x1. Storage connectivity includes eight SATA 6 Gb/s, from which two wire out as a SATA-Express 16 Gb/s slot; and an M.2 slot. Other modern connectivity includes two USB 3.1 ports, eight USB 3.0 ports, two Intel-driven gigabit Ethernet interfaces, 802.11 ac WLAN with Bluetooth 4.0, and Crystal Sound 2 audio (115 dBA SNR CODEC, ground-layer isolation, audio-grade capacitors, EMI shielding, and DTS Ultra PC II).
View at TechPowerUp Main Site
Expansion slots include three PCI-Express 3.0 x16 (x16/NC/NC or x8/x8/NC or x8/x4/x4), and four PCI-Express 2.0 x1. Storage connectivity includes eight SATA 6 Gb/s, from which two wire out as a SATA-Express 16 Gb/s slot; and an M.2 slot. Other modern connectivity includes two USB 3.1 ports, eight USB 3.0 ports, two Intel-driven gigabit Ethernet interfaces, 802.11 ac WLAN with Bluetooth 4.0, and Crystal Sound 2 audio (115 dBA SNR CODEC, ground-layer isolation, audio-grade capacitors, EMI shielding, and DTS Ultra PC II).
![](https://www.techpowerup.com/img/15-06-02/43a_thm.jpg)
![](https://www.techpowerup.com/img/15-06-02/43b_thm.jpg)
View at TechPowerUp Main Site